应用于2.4 GHz WIFI的高线性功率放大器的设计  

Design of high linearity Power Amplifier applied to 2.4 GHz WIFI

作　　者：陈睿源 陈磊 CHEN Ruiyuan;CHEN Lei(School of Electronic and Information Engineering,Shanghai University of Electric,Shanghai 201306,China)

机构地区：[1]上海电力大学电子与信息工程学院,上海201306

出　　处：《电子设计工程》2025年第4期21-24,共4页Electronic Design Engineering

摘　　要：为满足2.4 GHz频段的WIFI射频前端芯片的需要,设计了一种基于SAIC HG工艺的高线性、高功率射频Ⅲ-Ⅴ族功率放大器(PA)。该PA采用了二级放大架构,实现了29 dBm的饱和输出功率。在2.4~2.5 GHz工作频段内增益达到28.8 dB。使用ADS热电子仿真在版图层面对PA的输出级功率单元布局进行优化,同时基于标准QFN封装对芯片进行了完整的封装体建模联合仿真。该PA在802.11ax MCS11 bandwidth 40 MHz 1024QAM调制下,线性功率为20 dBm@DEVM=-43 dB.To meet the requirements of a 2.4 GHz WIFI RF front-end chip,a high-linear,high-power RF Ⅲ-Ⅴ family Power Amplifier(PA)based on SAIC HG technology was designed.The PA adopts a twostage amplification architecture,achieving a saturated output power of 29 dBm.The gain within the operating frequency range of 2.4~2.5 GHz reaches 28.8 dB.In this paper,ADS thermal simulation was used to optimize the layout of power cell.And the chip was packaged and modeled based on the standard QFN package for co-simulation.Under 802.11ax MCS11 bandwidth 40 MHz 1024QAM modulation,the linear power is 20 dBm@EVM=-43 dB.

关 键 词：射频前端 高线性 功率放大器 WIFI 热电子仿真 封装体仿真 

分 类 号：TN365[电子电信—物理电子学]