新型机柜半导体空调制冷性能试验研究  

Experimental study on refrigeration performance of new cabinet semiconductor air conditioning

作　　者：刘丽君 盛健[1,2] 张华 许贯禄[1] LIU Lijun;SHENG Jian;ZHANG Hua;XU Guanlu(School of Energy and Power Engineering,University of Shanghai for Science and Technology,Shanghai 200093,China;Shanghai Key Laboratory of Multiphase Flow and Heat Transfer in Power Engineering,Shanghai 200093,China)

机构地区：[1]上海理工大学能源与动力工程学院,上海200093 [2]上海市动力工程多相流动与传热重点实验室,上海200093

出　　处：《流体机械》2025年第1期17-24,共8页Fluid Machinery

基　　金：上海市2020年度“科技创新行动计划”技术标准项目(20DZ2204400)。

摘　　要：为了实现对机柜温度的精确控制,设计了一种电器柜集成半导体空调,采用标定型房间量热计法,通过试验研究了输入电流(6~11 A)、环境温度(26~35℃)、箱内外温差(0~40℃)、热端风量等参数对机柜半导体空调制冷性能的影响。结果表明:在环境温度26℃,箱内外温差20℃时,半导体空调最佳工作电流为8 A(36 V),此时制冷量最大(213 W);当电流为8 A(36 V)时,随着环境温度(20~35℃)升高,制冷量提高了13.9%,COP提高了11.9%;随着箱内外温差(0~40℃)增大,制冷量和COP均显著增大(108~340 W,0.38~1.21),热交换量的提高是制冷量上升的主要原因;热端风扇的风量从108.6 m^(3)/h升高至156 m^(3)/h时,制冷量提高了4.02%,COP提高了1.50%。研究结果可为机柜半导体空调设计优化提供参考。An integrated semiconductor air conditioner for electrical cabinet is designed,and the effects of input current(6~11 A),ambient temperature(20~35℃),temperature difference between inside and outside the cabinet(0~40℃)and air volume at the hot end on the refrigeration performance of the cabinet semiconductor air conditioner are studied by using the calibrated room calorimeter method.The experimental results indicate that when the ambient temperature is 26℃and the temperature difference between the inside and outside of the box is 20℃,the optimal working current of the semiconductor air conditioner is 8 A(36 V),and the refrigeration capacity is the largest(213 W).When the current is 8 A(36 V),with the increase of ambient temperature(20~35℃),the cooling capacity and COP increase by 13.9%and 11.9%,respectively.With the increase of temperature difference(0~40℃)inside and outside the box,the refrigeration capacity and COP both increase significantly(108~340 W,0.38~1.21),and the increase of heat exchange capacity is the main reason for the increase of refrigeration capacity.When the air volume of the hot-end fan is increased from 108.63 m^(3)/h to 156 m^(3)/h,the cooling capacity increased by 4.02%and the COP increased by 1.50%.It can provide reference for the design optimization of new cabinet semiconductor air conditioning.

关 键 词：半导体制冷 机柜空调 量热计法 制冷性能 

分 类 号：TB663[一般工业技术—制冷工程] TB657.2