高密度集成收发组件热电协同设计  

Thermal-electric co-design of high density integrated transmitter and receiver components

作　　者：朱啸宇 李伟 胡梦婕 ZHU Xiaoyu;LI Wei;HU Mengjie(Nanjing Electronic Equipment Research Institute,Nanjing 210007)

机构地区：[1]南京电子设备研究所,南京210007

出　　处：《电气技术》2025年第2期75-80,共6页Electrical Engineering

摘　　要：近年来,有源相控阵雷达在尺寸、质量和功率密度等方面的要求越来越高,收发组件的体积、功率、散热等面临更大的挑战。本文提出一种高密度集成收发组件热电协同设计方案,设计出一款高导热、高输出功率、高集成度的系统级封装,实现了收发组件的收发前端功能,并在组件中验证了其性能。In recent years,active phased array radar has imposed increasingly demanding requirements in aspects such as size,weight,and power density,presenting considerable challenges to the volume,power,and heat dissipation of the transmitter and receiver components.This paper proposes a thermal-electric co-design scheme for high density integrated transmitter and receiver components and designs a system in package with high efficiency heat dissipation,high output power,and high integration to achieve the transmitter and receiver front-end functions of the components which has been verified in the components.

关 键 词：收发组件 热电协同设计 高导热 高集成度 系统级封装(SIP) 

分 类 号：TN9[电子电信—信息与通信工程]