基于数据驱动的换流阀用IGBT模块芯片焊料层状态评估  

Data driven solder layer state evaluation of IGBT module chip for converter valve

作　　者：黄雄峰 段熙尧 黄明 陈忠 祝琳 张宇娇 HUANG Xiongfeng;DUAN Xiyao;HUANG Ming;CHEN Zhong;ZHU Lin;ZHANG Yujiao(Anhui Province Key Laboratory of Semiconductor Packaging and Reliability,School of Electrical and Automation Engineering,Hefei University of Technology,Hefei 230009,China;Electric Power Research Institute,State Grid Anhui Electric Power Co.,Ltd.,Hefei 230601,China)

机构地区：[1]合肥工业大学电气与自动化工程学院,功率半导体封装与可靠性安徽省重点实验室,安徽合肥230009 [2]国网安徽省电力有限公司电力科学研究院,安徽合肥230601

出　　处：《河北大学学报(自然科学版)》2025年第1期10-19,共10页Journal of Hebei University(Natural Science Edition)

基　　金：安徽省自然科学基金资助项目(JZ2023GJDQ0018)。

摘　　要：换流阀用绝缘栅双极型晶体管(IGBT)模块在风电输送与电网互联等领域得到广泛应用,随着运行时间的增长,IGBT芯片焊料层易发生热疲劳损伤,导致模块可靠性降低,因此实现IGBT模块芯片焊料层状态评估尤为关键.为此,提出一种基于数据驱动的换流阀用IGBT模块芯片焊料层状态评估方法.首先,分析焊料层的疲劳机理,并从数据的表征能力和获取难易程度出发,选取能够反映芯片焊料层疲劳状态的评估参数;其次,建立不同焊料层疲劳损伤状态的IGBT模块电热耦合模型,并通过有限元计算获得“疲劳状态-评估参数”数据;最后,考虑芯片焊料层疲劳状态与评估参数之间的非线性、相互交叉等问题,选取多种算法共同实现由评估参数到芯片焊料层的疲劳状态的映射,并对评估参数发展趋势进行预测.结果表明本评估方法准确性、实时性均满足工程需要,可为IGBT模块运维提供可靠依据.Insulated gate bipolar transistor(IGBT)modules for converter valves are widely used in fields such as wind power transmission and grid interconnection.IGBT modules for converter valves have been widely used in wind power transmission and grid interconnection.As the operating time increases,the IGBT chip solder layer is prone to thermal fatigue damage,leading to a decrease in module reliability.Therefore,it is particularly critical to evaluate the state of the IGBT module chip solder layer.To this end,this paper proposes a data-driven method for evaluating the state of the IGBT module chip solder layer for converter valves.Firstly,the fatigue mechanism of the solder layer is analyzed,and evaluation parameters that can reflect the fatigue state of the chip solder layer are selected based on their ability to represent data and the ease of acquisition.Secondly,an electro-thermal coupling model of the IGBT module with different fatigue damage states of the solder layer is established,and finite element calculations are performed to obtain‘fatigue state-evaluation parameter data.Finally,considering the non-linearity and cross-correlation issues between the fatigue state of the chip solder layer and the evaluation parameters,multiple algorithms are selected to jointly achieve the mapping from the evaluation parameters to the fatigue state of the chip solder layer and predict the development trend of the evaluation parameters.The results show that the accuracy and real-time performance of this evaluation method can meet the engineering needs,providing a reliable basis for the operation and maintenance of IGBT modules.

关 键 词：芯片焊料层 状态评估 数据驱动 评估参数 电热耦合模型 

分 类 号：TP181[自动化与计算机技术—控制理论与控制工程]