Record-high heat transfer performance of spray cooling on 3D-printed hierarchical micro/nano-structured surface  

三维有序微纳多级结构实现超高热流的喷雾冷却

作　　者：Yongyan Hu Yifan Lei Xiuliang Liu Ronggui Yang 胡雍炎;雷逸凡;刘修良;杨荣贵

机构地区：[1]School of Energy and Power Engineering,Huazhong University of Science and Technology,Wuhan 430074,China [2]College of Engineering,Peking University,Beijing 100871,China

出　　处：《Science Bulletin》2025年第2期223-231,共9页科学通报(英文版)

基　　金：National Natural Science Foundation of China(52036002)。

摘　　要：Managing high-flux waste heat with controllable device working temperature is becoming challenging and critical for the artificial intelligence,communications,electric vehicles,defense and aerospace sectors.Spray cooling,which combines forced convection with phase-change latent heat of working fluids,is promising for high flux heat dissipation.Most of the previous studies on spray cooling enhancement adopted high spray flow rates to strengthen forced convection for high critical heat flux(CHF),leading to a low heat transfer coefficient(HTC).Micro/nanostructured surfaces can enhance boiling,but bubbles inside the structures tend to form a vapor blanket,which can deteriorate heat transfer.This work demonstrates simultaneous enhancement of CHF and HTC in spray cooling by improving both evaporation and liquid film boiling on three-dimensional(3D)ordered hierarchical micro/nano-structured surface.The hierarchical micro/nano-structured surface is designed to coordinate the transport of spray droplets,capillary liquid films,and boiling bubbles to enhance spray cooling performance.Boiling inversion where superheat decreases with increasing heat flux is observed,leading to an ultra-high HTC due to the simultaneous promotion of bubble nucleation and evaporation.Unprecedented CHF is obtained by overcoming the liquid–vapor counterflow,i.e.,synergistically facilitating bubble escape and liquid permeation.A record-breaking heat transfer performance of spray cooling is achieved with a maximum heat flux of1273 W/cm^(2)and an HTC of 443.7 kW/(m^(2)K)over a 1 cm^(2)heating area.

关 键 词：Spray cooling Liquid film boiling Liquid film evaporation Hierarchical structure Thermal management 

分 类 号：TB66[一般工业技术—制冷工程]