半导体硅片脱胶清洗插片一体机的研发与应用  

Research on and Application of an Integrated Machine for De-gluing,Cleaning and Inserting Semiconductor Silicon Wafers

作　　者：王国瑞 姚长娟 杨铭 杨骅 WANG Guo-rui;YAO Chang-juan;YANG Ming;YANG Hua(Tianjin Huanbo Science&Technology Co.,Ltd.;Zhonghuan Information College Tianjin University of Technology)

机构地区：[1]天津环博科技有限责任公司 [2]天津理工大学中环信息学院

出　　处：《中国标准化》2024年第S1期369-374,共6页China Standardization

摘　　要：随着半导体技术的快速发展,硅片的生产和加工要求越来越高,其中脱胶清洗和插片工艺是关键环节之一。为了提高生产效率和产品质量,开发高效可靠的脱胶清洗插片一体机成为半导体制造业的迫切需求。本文针对半导体硅片脱胶清洗插片一体机的标准化问题进行了深入研究,从设备设计、工艺流程、标准制定等方面进行了系统分析和探讨,旨在为相关设备的研发和应用提供理论支持和技术指导。With the rapid development of semiconductor technology,the production and processing requirements for silicon wafers are becoming increasingly stringent,with de-gluing,cleaning,and inserting wafer in the key processes.To improve production efficiency and product quality,the development of an efficient and reliable integrated de-gluing,cleaning,and inserting wafers machine has become an urgent demand in the semiconductor manufacturing industry.This paper conducts an in-depth study on the standardization of such integrated machines,and discusses aspects such as equipment design,process flow,and standards development,aiming to provide theoretical support and technical guidance for the development and application of related equipment.

关 键 词：半导体硅片 脱胶 清洗 插片 一体机 标准化 工艺流程 

分 类 号：TN304.12[电子电信—物理电子学]