直流母线薄膜电容器液冷散热特性分析  

Analysis of liquid cooling heat dissipation characteristics of DC-link film capacitors

作　　者：邹文鹏 徐昊 赵美云[1] ZOU Wen-peng;XU Hao;ZHAO Mei-yun(Mechanical and Electrical Engineering Department,Tongling Polytechnic,Anhui Tongling 244000,China;Weichai Power Co.,Ltd.,Shandong Weifang 261000,China)

机构地区：[1]铜陵职业技术学院机械电气工程系,安徽铜陵244000 [2]潍柴动力股份有限公司,山东潍坊261000

出　　处：《齐齐哈尔大学学报(自然科学版)》2025年第1期12-21,共10页Journal of Qiqihar University(Natural Science Edition)

基　　金：基于CAE技术的复杂壳体件注塑成型工艺研究(tlpt2022NK003);模具设计与制造专业教学创新团队(2023cxtd185)。

摘　　要：为解决直流母线薄膜电容器耐高温、耐纹波电流能力不足的问题,将微通道冷却板设计在直流母线薄膜电容器中。通过降低热阻从而提升耐高温、耐纹波电流能力;建立三维模型,通过Fluent进行流固共轭传热仿真,确定最适宜的流向、进口流速等关键要素,最终对比普通封装电容器的热阻及耐纹波电流值。结果表明,同向流动和进口流速为0.3m/s能达到最好的散热效果,较普通封装电容器耐纹波电流提升253Arms,热阻降低83.53%。微通道冷却板结合直流母线薄膜电容器的设计能大幅降低热阻,从而提升电容器耐纹波电流,可为后续直流母线薄膜电容器的散热设计及优化提供一定的参考价值。To address the issues of insufficient high-temperature resistance and ripple current endurance of DC-link film capacitors,microchannel cooling plates were integrated into DC-link film capacitors.This integration aims to enhance high-temperature resistance and ripple current endurance by reducing thermal resistance.A three-dimensional model was established,and Fluent was utilized for fluid-structure coupled heat transfer simulation to determine the optimal flow direction,inlet flow velocity.Finally,the thermal resistance and ripple current endurance of common packaged capacitors were compared.The results indicate that co-directional flow and an inlet flow velocity of 0.3m/s achieve the best heat dissipation effect,increasing the ripple current endurance by 253Arms compared to common packaged capacitors,and reducing the thermal resistance by 83.53%.The combination of microchannel cooling plates and DC-link film capacitors design significantly reduces thermal resistance,thereby enhancing the capacitor's ripple current endurance.This study provides valuable insights for the thermal design and optimization of DC-link film capacitors in the future.

关 键 词：直流母线薄膜电容器 微通道冷却板 纹波电流 数值仿真 热阻 

分 类 号：TM531[电气工程—电器]