美国政府半导体研发最新战略布局和启示  

Analysis of Strategic Layout of U.S. Government Semiconductor R&D and Enlightenment for China

作　　者：程如烟 邢小宇 李兆瑞 CHENG Ruyan;XING Xiaoyu;LI Zhaorui(Institute of Scientific and Technical Information of China,Beijing 100038)

机构地区：[1]中国科学技术信息研究所,北京100038

出　　处：《全球科技经济瞭望》2024年第11期1-8,共8页Global Science,Technology and Economy Outlook

基　　金：国家重点研发计划项目“颠覆性技术感知响应平台研发与应用示范”(2019YFA0707200)。

摘　　要：近年来,随着国际科技竞争的不断加剧,为确保美国在半导体领域的全球领先地位,美国政府不断加强半导体研发的战略布局。基于美国《芯片和科学法案》以及美国联邦部门的政策行动,梳理分析了美国政府推进半导体研发的最新战略布局。一是设立国家半导体技术中心作为全国研发的枢纽,开展先进半导体技术的研究和原型开发;二是建立芯片制造研究所,促进芯片制造流程的创新;三是设立国家先进封装制造计划,通过封装创新提升芯片性能;四是启动芯片计量计划,推进芯片测量科学和相关标准。最后对美国政府推进半导体研发的特点进行了分析并提出了几点启示。In recent years,with the increasing international scientific and technological competition,the U.S.government has continuously strengthened the strategic layout of semiconductor research and development to ensure its global leading position in the semiconductor field.Based on the U.S.Chip and Science Act and the policy actions of the U.S.federal departments,this paper combs and analyzes the latest strategic layout of the U.S.government to promote semiconductor research and development.First,setting up the National Semiconductor Technology Center as the national R&D hub to carry out research and prototype development of semiconductor technology;Second,establishing Manufacturing USA Institutes to promote the innovation of chip manufacturing process;Third,setting up National Advanced Packaging Manufacturing Program to improve chip performance through packaging innovation;Fourth,launching Metrology Program to promote chip measurement science and related standards.In the end,this paper analyzes the characteristics of the U.S.government’s promotion of semiconductor R&D and puts forward some enlightenment.

关 键 词：美国 国家半导体技术中心 芯片制造研究所 国家先进封装制造计划 芯片计量计划 

分 类 号：C932[经济管理—管理学]