新能源汽车薄膜电容器温度场仿真与散热分析  

Temperature Field Simulation and Heat Dissipation Analysis of a Film Capacitor for New Energy Vehicle

作　　者：韦欣瑶 袁涛 李章毫 昌斌 淡金金 肖晨光 Wei Xinyao;Yuan Tao;Li Zhanghao;Chang Bin;Dan Jinjin;Xiao Chenguang(School of Mechanical and Automotive Engineering,Shanghai University of Engineering Science,Shanghai 201620,China;Guangzhou Junyi Electronics Technology Co.,Ltd.,Guangzhou 510660,China)

机构地区：[1]上海工程技术大学机械与汽车工程学院,上海201620 [2]广州市骏艺电子科技有限公司,广州510660

出　　处：《机电工程技术》2025年第2期78-82,共5页Mechanical & Electrical Engineering Technology

基　　金：国家自然科学基金资助项目(52005318);上海工程技术大学大学生创新训练项目(CX2301025)。

摘　　要：为提升新能源汽车电机控制器用薄膜电容器的散热效果,通过电-热耦合仿真和流体动力学仿真,分析电容器温度场的分布情况,在电容器外壳设计微通道冷却板,研究微通道冷却板的散热效果和电容器的温度变化情况。在180 A纹波电流工况及25~80℃环境温度下,利用ANSYS电-热耦合仿真,分析电容器整体的温度场分布情况;在电容器外壳设计微通道冷却板散热结构,利用FLUENT三维温度场仿真,分析电容器最高温度和平均温度的变化趋势,研究电容器芯子温度的分布情况。结果表明:在不同环境温度下,电容器外壳靠近高压直流端子处的局部温度最高;外壳安装微通道冷却板的电容器相比原电容器,整体最高温度在不同环境温度中平均降低30.45%,芯子最高温度在65℃环境温度中降低4.77℃。In order to improve the heat dissipation effect of film capacitor for new energy vehicle motor controller,through electro-thermal coupling simulation and fluid dynamics simulation,the distributions of the temperature fields of the capacitor are analyzed,the micro-channel cooling plates in the capacitor housing are designed,the heat dissipation effects of the micro-channel cooling plates and the temperature change of the capacitor are studied.Under 180 A ripple current condition and 25~80℃ambient temperatures,the temperature fields distributions of the capacitor as a whole are analyzed by ANSYS electro-thermal coupling simulation;the heat dissipation structure of microchannel cooling plates are designed in the housing of the capacitor,by FLUENT three-dimensional temperature field simulation,the trends of the maximum and average temperatures of the capacitor are analyzed,the distribution of the cores′temperature is investigated.The results indicate that under different ambient temperatures,the local temperatures of the capacitor housing near the high-voltage DC terminals are the highest.Compare with the original capacitor,the overall maximum temperatures of the capacitor with the micro-channel cooling plates are lowered by an average of 30.45%in different ambient temperatures,and the maximum temperature of the cores is lowered by 4.77℃in 65℃ambient temperature.

关 键 词：薄膜电容器 温度场 电-热耦合 微通道冷却板 散热仿真 

分 类 号：TM531[电气工程—电器]