基于灰色关联与量化模型的片式元器件焊点抗剪强度预测分析  

Predictive analysis of shear strength of soldered joints of chip components based on grey correlation and quantitative model

作　　者：樊勋 邓超 张玲 刘晓斌 黄春跃[2] 高超 FAN Xun;DENG Chao;ZHANG Ling;LIU Xiaobin;HUANG Chunyue;GAO Chao(Box 429,Cha Dianzi,Chengdu 610036,China;Guilin University of Electronic Science and Technology,Guilin 541004,China)

机构地区：[1]成都市茶店子429信箱,成都610036 [2]桂林电子科技大学,桂林541004

出　　处：《焊接》2025年第2期38-46,共9页Welding & Joining

基　　金：国防科工局基础科研计划(JCKY2019210B004)。

摘　　要：【目的】对表贴电阻元器件进行了焊接工艺和焊点最大抗剪强度的试验研究,基于试验数据运用灰色关联与量化模型进行焊点焊接强度预测。【方法】为此,采用元器件焊点推脱力试验获取了相应的焊点抗剪性能,设计了36组工艺参数组合的非完全正交试验,分析了焊膏涂覆量、贴装压力、焊接时间、焊接温度、器件贴装精度等参数对抗剪强度的影响,并对测试值进行了灰色关联分析和回归模型预测,准确描述了不同工艺参数与最大抗剪强度的定量关系。【结果】结果表明,焊接加热温度对片式元器件焊点最大抗剪强度的影响最大,其灰色关联度达到0.759,器件贴装精度影响最小,灰色关联度为0.734。【结论】该研究通过试验和回归预测模型结合的研究方法可准确描述焊接工艺参数和焊接质量之间的定量关系。[Objective]An experimental study of soldering process and maximum shear strength of soldered joints was carried out for surfacemounted resistive components,and a gray correlation and quantization model was used to predict strength of soldered joints based on experimental data.[Methods]To this end,corresponding shear properties of soldered joints were obtained by push-off force test of soldered joints of component.36 groups of incomplete orthogonal tests of soldering parameters combinations were designed to analyze effects of soldering parameters such as amount of solder paste coating,placement pressure,welding time,welding temperature and device mounting accuracy on shear strength.Grey correlation analysis and regression model prediction were carried out on the test values.The quantitative relationship between different soldering parameters and the maximum shear strength was described accurately.[Results]The results showed that welding heating temperature of chip components had the greatest influence on the maximum shear strength of soldered joints of chip components with a gray correlation degree of 0.759,while device placement accuracy had the least influence with a gray correlation degree of 0.734.[Conclusions]In the study,through combination of experimental and regression prediction models,quantitative relationship between soldering parameters and soldering quality can be accurately described.

关 键 词：片式元器件焊点 抗剪强度 焊接工艺参数 灰色关联分析 回归预测模型 

分 类 号：TG454[金属学及工艺—焊接]