板坯连铸结晶器铜板与冷却水界面传热数值模拟研究  

Numerical Simulation of Heat Transfer between Copper Plate and Cooling Water Interface in Slab Continuous Casting Mold

作　　者：丁见鹏 马文会[1,3,4] DING Jianpeng;MA Wenhui(Faculty of Metallurgical and Energy Engineering,Kunming University of Science and Technology,Kunming 650093,China;Pangang Metallurgical Materials Co.,Ltd.,Panzhihua 617000,Sichuan,China;State Key Laboratory of Clean Utilization of Complex Nonferrous Metal Resources,Kunming University of Science and Technology,Kunming 650093,China;School of Engineering,Yunnan University,Kunming 650500,China)

机构地区：[1]昆明理工大学冶金与能源工程学院,云南昆明650093 [2]攀钢冶金材料有限责任公司,四川攀枝花617000 [3]昆明理工大学复杂有色金属资源清洁利用国家重点实验室,云南昆明650093 [4]云南大学现代工学院,云南昆明650500

出　　处：《昆明理工大学学报(自然科学版)》2025年第1期10-16,共7页Journal of Kunming University of Science and Technology(Natural Science)

基　　金：云南省科技重大专项(202202AG050007).

摘　　要：结晶器铜板传热对凝固坯壳的均匀生长至关重要.本研究依据反算热流边界条件,建立了结晶器铜板传热-冷却水流动的耦合数值模型,通过热电偶监测和水缝出口实测温度验证了模型的准确性,探讨了铜板厚度和冷却水流速对结晶器传热的影响.研究结果表明:宽面和窄面上的热面最高温度区域出现在距结晶器顶部约120~130 mm的位置.铜板厚度每减薄5 mm,铜板整体温度均下降,宽面和窄面的热面最高温度平均降低21.3℃和28.3℃,这会增加弯月面附近的非均匀传热程度.冷却水流速每增加2 m/s,宽面和窄面热面的最高温度平均下降7℃和6.75℃.另外,结晶器传热分析表明,当铜板磨损到一定程度后,很难通过降低冷却水流量的方式补偿铜板磨损造成的热面温度降低.Heat transfer of the mold copper plate is vital for the uniform growth of the solidified shell.This research establishes a coupled numerical model of heat transfer and cooling water flow in the mold copper plate based on the inverse heat flux boundary conditions.The precision of the model is verified by thermocouple monitoring and measured temperature at the outlet of the water slot.Next,the effects of copper plate thickness and cooling water flow rate on the heat transfer of the mold are further discussed.The results show that the highest temperature area of the hot face on the wide and narrow faces appears at a distance of about 120~130 mm from the top of the mold.When the thickness of the copper plate is reduced by 5 mm,the overall temperature of the copper plate decreases,and the maximum temperature of the hot face of the wide and narrow faces decreases by 21.3℃and 28.3℃on average,respectively,which also increases the degree of non-uniform heat transfer near the meniscus.For every 2 m/s increase in the cooling water flow rate,the maximum temperature of both the wide and narrow hot faces decreased by an average of 7℃and 6.75℃.In addition,the heat transfer analysis of the mold shows that when the copper plate is thinned to a certain extent,it is difficult to compensate for the decrease in the hot face temperature caused by the wear of the copper plate by reducing the cooling water flow.

关 键 词：连铸板坯 结晶器 传热 数值模拟 

分 类 号：TF341.6[冶金工程—冶金机械及自动化]