新型半导体激光巴条衬底与液冷微结构集成散热研究  

Integrated Heat Dissipation of A Novel Laser Diode Array Substrate and A Liquid-cooled Microstructure

作　　者：陈琅 刘嘉辰 章珺越 吴顺华 黄维洲 张锐 王贞福[1] 张佳晨 李特[1] CHEN Lang;LIU Jiachen;ZHANG Junyue;WU Shunhua;HUANG Weizhou;ZHANG Rui;WANG Zhenfu;ZHANG Jiachen;LI Te(State Key Laboratory of Transient Optics and Photonics,Xi’an Institute of Optics and Precision Mechanics,Chinese Academy of Sciences,Xi’an 710119,China;University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院西安光学精密机械研究所,瞬态光学与光子技术国家重点实验室,陕西西安710119 [2]中国科学院大学,北京100049

出　　处：《发光学报》2025年第2期343-353,共11页Chinese Journal of Luminescence

基　　金：国家自然科学基金(61504167);陕西省自然科学基金(2023-JC-YB-556,2022JQ-531,2019ZY-CXPT-03-05,2018JM6010,2015JQ6263);陕西省科技厅人才项目(2017KJXX-72)。

摘　　要：芯片衬底与微通道集成一体化是一项全球前沿的研究热点,与传统液冷微通道热沉相比,具有革命性的优势,已成功应用于绝缘栅双极型晶体管等芯片领域,展现出卓越的散热性能。随着大科学装置及工业领域对半导体激光芯片输出功率需求的增加,热管理成为一项关键技术问题。传统激光巴条冷却研究主要集中在优化液冷热沉结构,但其散热能力受到传热路径热阻的限制。为应对这一挑战,本研究基于芯片衬底与微通道集成一体化设计,提出了一种新型分布式流型结构,用于半导体激光芯片的高效散热。该设计显著缩短了传热路径,减少了热阻,从而有效降低芯片结温与冷却流量,为实现高集成度和高散热量的激光芯片提供了重要技术支撑。研究结果表明,本文提出的分布式流型结构突破了半导体激光巴条衬底微通道设计的瓶颈,在0.35 L/min@20℃的液冷条件下,实现了芯片温升≤40℃的目标,并在1000 W/cm^(2)的高热流密度条件下获得了最佳填充因子为0.25,芯片温升为30.52℃的模拟结果。The integration of chip substrates with microchannels represents a cutting-edge research focus globally.Compared to traditional liquid-cooled microchannel heat sinks,this technology offers revolutionary advantages and has been successfully applied in chips like insulated gate bipolar transistor,demonstrating exceptional cooling performance.As the demand for higher output power from semiconductor laser chips in large scientific facilities and industrial applications increases,heat management has become a critical issue.Traditional research on laser bar cooling has mainly focused on optimizing liquid-cooled heat sink structures.However,their cooling capacity is constrained by thermal resistance of the heat transfer path.To address this challenge,this study proposes a novel distributed flow pattern structure based on the integration of chip substrates with microchannels,aiming for efficient cooling of semiconductor laser bars.This design significantly shortens the heat transfer path and reduces thermal resistance,effectively lowering the chip junction temperature and cooling flow rate.It provides essential technical support for achieving highly integrated and high heat dissipation laser bars.The research indicates that the proposed distributed flow pattern structure overcomes the design challenges of microchannels in semiconductor laser bar substrates.Under liquid cooling conditions of 0.35 L/min@20℃,it achieves the target of a chip temperature rise of≤40℃,with a simulated result of a temperature rise of 30.52℃ at a high heat flux density of 1000 W/cm and an optimal filling factor of 0.25.

关 键 词：半导体激光巴条 液冷 衬底微结构 片上集成散热 

分 类 号：TN248.4[电子电信—物理电子学]