平面玻璃光窗片超声清洗工艺改善研究  

Improvement Research on Ultrasonic Cleaning Process for Plane Optical Window Elements

作　　者：盛海见 袁礼华 裴红山 周晓波 金小冰 SHENG Hai-jian;YUAN Li-hua;PEI Hong-shan;ZHOU Xiao-bo;JIN Xiao-bing(CETC Group of Chip Technology Co.LTD,Chongqing 400060,China)

机构地区：[1]中电科芯片技术(集团)有限公司,重庆400060

出　　处：《山东工业技术》2025年第1期95-101,共7页Journal of Shandong Industrial Technology

摘　　要：分析了光窗片磨抛加工表面的特征和污染物的物理实质,探讨了功率、频率、温度等超声清洗工艺的关键工艺因素及其作用原理。通过实验研究,最终确定了功率密度0.6 W/cm^(2)、末级频率80 kHz、单级超声时间8 min、温度57℃、清洗剂浓度6.0%、网眼尺寸10 mm*10 mm和离心甩干的工艺方案。实验证明,改善后的工艺方案可提升成品率14%,单片擦拭时间可缩短3.9 s,可以获得更高的表面质量。为同行业在平面光窗片的超声清洗生产活动提供了工业性实践参考。This paper analyzes the characteristics of the polished surfaces of optical window elements and the physical essence of pollutants,explores the key process factors and their working principles of ultrasonic cleaning technology such as power,frequency,and temperature.Through experimental research,the process scheme of power density 0.6W/cm^(2),final frequency 80 kHz,single-stage ultrasonic time 8min,temperature 57℃,cleaning agent concentration 6.0%,mesh size 10mm*10mm and centrifugal drying was finally determined.Experiments show that the improved process scheme can improve the yield by 14%,shorten the single-chip wiping time by 3.9s,and obtain higher surface quality.It provides an industrial practical reference for the cleaning production activities of plane optical windows in the same industry.

关 键 词：超声清洗 污染物 关键工艺因素 工艺改善 

分 类 号：TB559[理学—物理]