6 GHz~18 GHz超宽带小型化固态功放  

6 GHz~18 GHz Ultra-wideband Miniaturized Solid-state Power Amplifier

作　　者：吕刚 宋玉清 LU Gang;SONG Yuqing(Rflight Communication Electronic Co.,Ltd.,Nanjing 211106,China)

机构地区：[1]南京纳特通信电子有限公司,南京211106

出　　处：《微波学报》2025年第1期21-25,共5页Journal of Microwaves

基　　金：江苏省南京市江宁区关键核心技术攻关项目(2024JBGS005)。

摘　　要：超宽带固态功放在大功率合成、高热流密度散热及轻量小型化上存在相互制约的矛盾关系,文中基于脊波导H面T型功分/合成及波同阻抗变换拓扑架构,实现了6 GHz~18 GHz超宽带4路12 W(典型值)波导合成输出≥40 W、合成效率≥90%,并以标准波导口WRD500D36为射频端面,便于系统二次高效合成。结构采用铝嵌铜工艺,在高热源下方局部埋铜,在满足功放芯片高热流密度散热的同时又使得整体质量相比于纯铜减轻了54.5%。供电则采用了垂直互联工艺,利用波导固有立体结构空间,通过供电弹簧针将供电板与芯片供电垂直互联,简化了装配流程,进一步实现了减重与结构空间的优化利用。最终实现超宽带大功率、高热流密度散热与结构轻量小型化的高度集成,为6 GHz~18 GHz更大功率的固态功放研制提供了核心基础模块。Ultra-wideband solid-state power amplifier has a mutually constraining relationship in high-power synthesis,high-heat flux dissipation and lightweight miniaturization.Based on the ridge waveguide H-plane T-type power division/synthesis and wave impedance transformation topological architecture,this design achieves ultra-wideband(6 GHz~18 GHz)4-way 12 W(typical value)waveguide synthesis output≥40 W,synthesis efficiency≥90%,and takes the standard waveguide port WRD500D36 as the radio frequency end face,which is convenient for the secondary efficient synthesis of the system.An aluminum-embedded copper process is adopted by the structure and the copper is partially buried beneath the high heat source,which can reduce the weight of the power amplifier chip by 54.5%compared to pure copper while meeting the requirements of high heat flux heat dissipation.The vertical interconnection technology is adopted for power supply system.The inherent three-dimensional structure space of waveguides is utilized,and power supply spring pins are employed to achieve vertical interconnection between the power supply board and the chip power supply.This approach simplifies the assembly process and further realizes weight reduction and optimized utilization of structural space.Finally,the high integration of high power,high heat flux heat dissipation,and lightweight miniaturization of the structure is realized,providing the core basic module for the development of solid-state amplifiers with higher power in the 6 GHz~18 GHz.

关 键 词：固态功放 波导合成 超宽带 小型化 

分 类 号：TN722.75[电子电信—电路与系统]