基于三维匹配的L波段大功率收发组件设计  

Design of L-band high-power transceiver module based on three dimentional matching

作　　者：马涛 张良梁[1] 宋烨曦[1] 刘洋 罗盛午 郭亮 MA Tao;ZHANG Liang-liang;SONG Ye-xi;LIU Yang;LUO Sheng-wu;GUO Liang(Sichuan Jiuzhou Electric Appliance Group Co,Ltd,Mianyang 621000,China;Southwest Institue of Applied Magnetics,Mianyang 621000,China)

机构地区：[1]四川九洲电器集团责任有限公司,四川绵阳621000 [2]西南应用磁学研究所,四川绵阳621000

出　　处：《磁性材料及器件》2025年第1期52-56,共5页Journal of Magnetic Materials and Devices

摘　　要：为满足新一代应答主机小型化、多模化、高性能的需求,研制了一款基于三维匹配技术的大功率L波段收发组件。组件内部采用多芯片封装技术集成L波段大功率带通滤波器、收发切换、功率放大链路、接收限幅放大等功能电路,提供L波段应答系统的收发射频前级功能。在功率管匹配设计方面,采用全新的三维匹配结构,充分利用多层PCB板的垂直空间,实现了最优匹配网络。与传统的PCB平面匹配电路结构的模块相比,匹配电路尺寸缩小一半以上。实测结果显示:该收发组件的输出功率达到53.8 dBm@1 GHz,尺寸仅为44.9 mm×39.9 mm×13.0 mm。A high-power L-band transceiver module based on 3D matching technology has been developed to meet the requirements of miniaturization, multimodality, and high performance for the new generation of response hosts. The internal components adopt multi chip packaging technology to integrate L-band high-power bandpass filters, transceiver switching,power amplification links, reception limiting amplification and other functional components, providing the reception and transmission RF front-end function of the L-band response system. In terms of power transistor matching design, this article adopts a new three-dimensional matching structure, fully utilizing the vertical space of multi-layer PCB boards, and achieving the optimal matching network. Compared with traditional PCB planar matching circuit modules, the matching circuit size can be reduced by more than half. The transceiver is manufactured and test, the output power of the transceiver reached 53.8 dBm@1 GHz, the size of circuit is 44.9 mm×39.9 mm×13.0 mm.

关 键 词：收发组件 L波段 三维匹配 

分 类 号：TM859[电气工程—高电压与绝缘技术]