2.5D C/SiC复合材料磁场/液体辅助皮秒激光制孔试验研究  

Experimental Study on Magnetic Field/Liquid-Assisted Picosecond Laser Drilling of 2.5D C/SiC Composites

作  者:刘畅[1] 王科骄 李丞 LIU Chang;WANG Kejiao;LI Cheng(Tiangong University,Tianjin 300387,China)

机构地区:[1]天津工业大学,天津300387

出  处:《航空制造技术》2025年第1期54-63,共10页Aeronautical Manufacturing Technology

基  金:国家自然科学基金(51705362)。

摘  要:2.5D C/SiC复合材料是航空国防领域耐高温构件用关键复合材料,其高硬度、高耐磨性使该材料的高质量微孔加工异常困难。本文提出了一种基于磁场/液体辅助(MLM)的2.5D C/SiC复合材料皮秒激光制孔工艺,通过提取微孔的出/入口直径、锥度、氧化、重铸层等特征,与皮秒激光加工(PM)、磁场辅助加工(MM)、液体辅助加工(LM)3种工艺进行了对比研究。结果表明,基于MLM的皮秒激光加工能够有效降低微孔的入口直径,同时增大出口直径,在两组不同的试验参数下分别获得了锥度1.3°及1.1°的微孔,比PM工艺的锥度分别降低了18.75%和45%,比MM工艺的锥度分别降低了13.33%和31.25%,比LM工艺的锥度分别降低了91.22%和79.63%。此外,利用EDS能谱分析、拉曼光谱以及XPS技术对制备的微孔开展了微观组织分析。可以发现,MLM工艺更有效地减少了孔壁的石墨化缺陷。其中,液体辅助避免了微孔入口处的氧化,同时清晰地观察到裸露的纤维和基体,有效避免了热损伤和重铸层缺陷。在皮秒激光制孔中,MLM的主要作用机制体现在液体的冷却效应、隔绝氧气机制,以及磁场纵向拉伸等离子体,从而减弱等离子体屏蔽效应。In the field of aerospace defense,2.5D C/SiC composites are crucial materials for high-temperature resistant components.The high hardness and wear resistance of these materials render the high-quality micro-hole machining exceptionally challenging.A picosecond laser drilling process for 2.5D C/SiC composites based on magnetic field/liquid-assisted machining(MLM)was proposed.By extracting the characteristics of micro-hole inlet/outlet diameter,taper,oxidation,and recast layer,a comparative study was conducted between MLM and three processes:picosecond laser machining(PM),magnetic field-assisted machining(MM),and liquid-assisted machining(LM).The results demonstrate that the picosecond laser machining based on MLM can effectively reduced the inlet diameter of the micro-holes while increasing the outlet diameter,achieving a micro-hole taper of 1.3°and 1.1°under two different sets of experimental parameters,the taper is reduced by 18.75%and 45%compared with PM process,reduced by 13.33%and 31.25%compared with MM process,reduced by 91.22%and 79.63%compared with LM process,respectively.Furthermore,microstructural analyses of the drilled micro-holes were performed using EDS spectroscopy,Raman spectroscopy,and XPS techniques.It was found that the MLM process more effectively reduced the graphitization defects on the hole walls.Among them,liquid-assisted machining avoids oxidation at the inlet of micro-holes,while clearly observing exposed fibers and matrix,effectively avoiding thermal damage and recast layer defects.In picosecond laser drilling,the primary mechanisms of MLM are attributed to the cooling effect of the liquid,its ability to isolate oxygen,and the longitudinal stretching of the plasma by the magnetic field,which reduces the plasma shielding effect.

关 键 词:皮秒激光 磁场/液体辅助加工 2.5D C/SiC复合材料 孔锥度 烧蚀机理 

分 类 号:V261.97[航空宇航科学与技术—航空宇航制造工程]

 

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