金刚石半导体衬底研磨抛光技术研究现状及展望  

Research Status and Prospect of Grinding and Polishing Technologies for Diamond Semiconductor Substrate

作　　者：刘帅伟 关春龙[1] 鲁云祥 王祥兵 吕昱翰 赵磊 易剑 江南 Liu Shuaiwei;Guan Chunlong;Lu Yunxiang;Wang Xiangbing;Lv Yuhan;Zhao Lei;Yi Jian;Jiang Nan(School of Material Science&Engineering,Henan University of Technology,Zhengzhou Henan 450001,China;Key laboratory of marine key materials,Zhejiang Key Laboratory of Marine Materials and Protection Technology,Ningbo Institute of Materials Technology&Engineering,Chinese Academy of Sciences,Ningbo Zhejiang 315201,China)

机构地区：[1]河南工业大学材料科学与工程学院,河南郑州450001 [2]中国科学院宁波材料技术与工程研究所,海洋关键材料重点实验室,浙江省海洋材料与防护技术重点实验室,浙江宁波315201

出　　处：《硬质合金》2025年第1期64-79,共16页Cemented Carbides

基　　金：宁波市重大科技攻关项目(2021ZDYF020196,2021ZDYF020198)。

摘　　要：随着半导体电子器件的集成化与小型化发展,金刚石优异的热导性、电导性成为制备半导体衬底的理想材料。为了满足半导体行业对电子器件高精度和高可靠性能的要求,需对金刚石表面进行抛光处理。然而,金刚石高硬度、高耐磨性、高化学惰性的特点,使金刚石的加工面临诸多困难,现有的金刚石抛光技术都有一定的自身优势和不足,急需一种在保证效率的情况下,同时获得光滑、平整、低损伤的金刚石表面抛光技术。因此,本文对金刚石抛光技术的国内外相关文献进行了梳理,总结了机械抛光、热化学抛光、化学机械抛光、等离子体刻蚀抛光、激光抛光等技术的原理与优缺点,对未来金刚石抛光技术来说,应朝着多种技术相互搭配以及智能化、精密化、环保化的方向发展,进而拓展金刚石材料的应用范围。With the integration and miniaturization of semiconductor electronic devices,the excellent thermal and electrical conductivity of diamond has made it an ideal material for preparing semiconductor substrates.The polished diamond surface is smoother,which can meet the requirements of semiconductor industry for high precision and high reliability,and has important value and significance in improving the performance of semiconductor equipment,prolonging service life and optimizing thermal management.However,the high hardness,wear resistance,and chemical inertness of diamonds pose significant challenges in their processing.Existing diamond polishing technologies have their own advantages and limitations,creating an urgent need for a polishing technology that achieves a smooth,flat,and low-damage diamond surface while ensuring efficiency.Therefore,this paper reviewed relevant literature in China and abroad on diamond polishing technology,summarizing the principles,advantages,and disadvantages of mechanical polishing(MP),thermochemical polishing(TCP),chemical mechanical polishing(CMP),plasma etching polishing(PEP),laser polishing(LP),and other methods.Future diamond polishing technology should develop in the direction of multi-technology integration,intelligence,precision,and environmental friendliness,thereby expanding the application range of diamond materials.

关 键 词：金刚石 半导体 抛光技术 表面粗糙度 材料去除率 平整度 

分 类 号：TN305.2[电子电信—物理电子学] TQ163[化学工程—高温制品工业] TB306[一般工业技术—材料科学与工程]