国产HPC与AI芯片制造装备技术现状与发展策略分析  

Technical Status and Development Strategies of Domestic High-Performance Computing and Artificial Intelligence Chip Manufacturing Equipment

作　　者：高岳[1] 郭春华[1] 米雪 刘容嘉 GAO Yue;GUO Chunhua;MI Xue;LIU Rongjia(The 45^(th)Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2025年第1期1-6,27,共7页Equipment for Electronic Products Manufacturing

摘　　要：回顾了国产高性能计算(HPC)与人工智能(AI)芯片制造装备的发展历程,总结了目前的技术现状与面临的挑战。分析了国内外高性能计算与人工智能芯片制造装备的发展趋势和技术特点,并提出了针对国产装备发展的具体策略与建议,以期推动我国在这一领域的自主创新能力和发展水平。The development process of domestic high-performance computing(HPC)and artificial intelligence(AI)chip manufacturing equipment are reviewed,and summarizing the current technical status and challenges faced.The development trends and technological characteristics of high-performance computing and artificial intelligence chip manufacturing equipment both domestically and internationally are analyzed.Finally,proposes specific strategies and recommendations for the develop-ment of domestic equipment with the aim of promoting autonomous innovation capabilities and develop-ment levels in this field within our country.

关 键 词：高性能计算 人工智能 芯片制造设备 国产化 发展策略 

分 类 号：TN305[电子电信—物理电子学]