半导体自动涂胶显影技术及设备研究  

Research on Semiconductor Automatic Coating and Developing Technology of Track

作　　者：黄华佑 杨丹 李运泉 HUANG Huayou;YANG Dan;LI Yunquan(Guangdong Institute of Special Equipment Inspection and Research Shunde Branch,Fuoshan 528000,China)

机构地区：[1]广东省特种设备检测研究院顺德检测院,广东佛山528000

出　　处：《电子工业专用设备》2025年第1期46-49,72,共5页Equipment for Electronic Products Manufacturing

基　　金：半导体晶圆全自动涂胶显影系统研究(2024QT-2-02)。

摘　　要：随着集成电路的特征尺寸不断缩小和晶圆尺寸的不断增大,半导体自动涂胶显影设备(Track)的技术水平显著影响整个集成电路制造过程的精度和效率。介绍了半导体自动涂胶显影设备的工艺技术及流程,对其关键部件及功能进行了分析,并就涂胶均匀性与精度控制、设备温度控制和自动化控制等关键技术进行了探讨。As the feature size of integrated circuits continues to shrink and wafer sizes increase,the technological level of Track significantly impacts the accuracy and efficiency of the entire integrated circuit manufacturing process.This paper introduces the process technology and flow of Track,analyzes its key components and functions,and discusses key technologies such as coating uniformity and accuracy control,equipment temperature control,and automation control.

关 键 词：半导体 涂胶显影设备 工艺技术 涂胶均匀性 温度控制 自动化 

分 类 号：TN305[电子电信—物理电子学]