Ag-Cu基活性钎料减小陶瓷与金属焊接残余应力的研究进展  

Research progress of reducing residual stress in welding between ceramics and metals with Ag-Cu-based active filler metals

作　　者：宋蕊立 杨森 王泽羽 王文涛 田彩利[1,3] SONG Ruili;YANG Sen;WANG Zeyu(SONG Ruili;YANG Sen;WANG Zeyu;WANG Wentao;TIAN Caili)

机构地区：[1]河北省科学院能源研究所,河北石家庄050081 [2]石家庄铁道大学材料科学与工程学院,河北石家庄050043 [3]燕山大学材料科学与工程学院,河北秦皇岛066004

出　　处：《焊接技术》2025年第1期1-7,I00001,共7页Welding Technology

基　　金：河北省科学院科技计划项目(24704)。

摘　　要：陶瓷及陶瓷基复合材料已广泛应用于电子通信、航天电子、医疗器械、汽车电子等领域。然而,陶瓷的脆性大、延展性差,难以加工,通常需要将其与金属连接,活性金属钎焊是可靠性较好的一种连接方式。但陶瓷与金属的热膨胀系数相差较大,致使钎焊接头在冷却过程中产生较大的残余应力,从而不利于保证接头的性能。文中探讨了残余应力产生的原因及常见的分析检测方法,并综述了采用Ag-Cu基活性钎料减小陶瓷/金属接头残余应力的研究;最后,对减小残余应力工作面临的挑战进行了展望。Ceramics and ceramic-based composite materials had been widely used in the fields of electronic communication,space electronics,medical devices,and automotive electronics.However,ceramics were brittle and have poor ductility,making them difficult to process.They usually need to be connected to metals,and active metal brazing is a more reliable connection method.But the thermal expansion coefficients of ceramics and metals differ significantly,which led to the formation of considerable residual stresses in the brazed joint during cooling,which was detrimental to the performance of the joint.This paper discussed the causes of residual stresses and common analysis and detection methods,and reviewed the research on reducing the residual stresses in ceramic∕metal joints using Ag-Cubased active brazing metals.Finally,the challenges faced in reducing residual stresses were outlined.

关 键 词：Ag-Cu基活性钎料 陶瓷/金属钎焊接头 残余应力 

分 类 号：TG425[金属学及工艺—焊接]