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作 者:Xinyi Wang Jiangbing Du Weihong Shen Ke Xu Zuyuan He 王心怡;杜江兵;沈微宏;徐科;何祖源(State Key Laboratory of Advanced Optical Communication Systems and Networks,Shanghai Jiao Tong University,Shanghai 200240,China;Institute of Photonic Chips,University of Shanghai for Science and Technology,Shanghai 200093,China;Department of Electronic and Information Engineering,Harbin Institute of Technology(Shenzhen),Shenzhen 518055,China)
机构地区:[1]State Key Laboratory of Advanced Optical Communication Systems and Networks,Shanghai Jiao Tong University,Shanghai 200240,China [2]Institute of Photonic Chips,University of Shanghai for Science and Technology,Shanghai 200093,China [3]Department of Electronic and Information Engineering,Harbin Institute of Technology(Shenzhen),Shenzhen 518055,China
出 处:《Chinese Optics Letters》2024年第12期1-6,共6页中国光学快报(英文版)
基 金:supported by the National Key Research and Development Program of China(No.2023YFB2905502);the National Natural Science Foundation of China(Nos.62122047 and 61935011)。
摘 要:In this Letter,a four-channel silicon photonic mode-division-multiplexing(MDM)and wavelength-division multiplexing(WDM)transmitter chiplet is proposed over a 1.65 mm~2 footprint,utilizing add-drop micro-ring modulators to simultaneously achieve electro-optic modulation and two-wavelength multiplexing.A dual-mode grating coupler with a side-distributed Bragg reflector for equalized two-mode coupling is realized with high chip-to-fiber coupling efficiency,so as to support the MDM optical fiber interface.A high data rate of up to 4×56 Gbps signaling is experimentally demonstrated,featuring applications like 200G quad small form-factor pluggable(QSFP)transceivers and indicating significant potential for highdensity and large-capacity 3D co-packaged optical interconnects through flip-chip-based electronic-photonic packaging.
关 键 词:high density silicon photonic MDM-WDM transmitter add-drop micro-ring modulator dual-mode grating coupler
分 类 号:TN491[电子电信—微电子学与固体电子学]
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