金属化膏剂分散工艺研究  

Research on Dispersion Process of Metalized Pastes

作　　者：韦艳[1] 安宏禹 于志强[1] 黄亦工[1] WEI Yan;AN Hong-yu;YU Zhi-qiang;HUANG Yi-gong(Beijing Vacuum Electronics Research Institute,Beijing 100015,China)

机构地区：[1]北京真空电子技术研究所,北京100015

出　　处：《真空电子技术》2025年第1期43-47,共5页Vacuum Electronics

摘　　要：采用两种工艺制备95瓷用Mo-Mn膏,分别为直接加黏结剂工艺和先用溶剂分散后加黏结剂工艺,对两种样品进行了对比测试。结果表明,直接加黏结剂工艺,最终烧结的Mo-Mn层与陶瓷之间有大量孔洞,金属–陶瓷封接强度低。先用溶剂分散然后加黏结剂工艺,最终烧结的Mo-Mn层与陶瓷之间没有孔洞,封接强度高。Two processes are used to prepare Mo-Mn paste for 95% Al_(2)O_(3) ceramics.One is to add binder to the powder directly,and the other is to disperse the binder with a solvent before adding.Comparison test is carried out and the results show that when the binder is directly added,there are a large number of pores between the final sintered Mo-Mn layer and the ceramic,and the metal-ceramic sealing strength is low;when the binder is dispersed and added,there are no pores between the Mo-Mn layer and the ceramic,and the sealing strength is high.

关 键 词：Mo-Mn膏剂 封接强度 金属-陶瓷封接 黏结剂 

分 类 号：TQ174[化学工程—陶瓷工业]