溶胶凝胶/氢还原工艺制备超细Cu-20W复合粉末及其烧结性能  

Preparation and sintering behavior of ultrafine Cu-20W composite powders by sol-gel with hydrogen reduction technology

作　　者：杨光 李革民 魏邦争 许荡 陈鹏起 程继贵[1,2,3] YANG Guang;LI Gemin;WEI Bangzheng;XU Dang;CHEN Pengqi;CHENG Jigui(School of Materials Science and Engineering,Hefei University of Technology,Hefei 230009,China;Anhui Provincial Powder Metallurgy Engineering Research Center,Hefei 230009,China;Ministry of Education Engineering Research Center for High-performance Copper Alloy Materials and Forming Processing,Hefei 230009,China)

机构地区：[1]合肥工业大学材料科学与工程学院,合肥230009 [2]安徽省粉末冶金工程技术研究中心,合肥230009 [3]高性能铜合金材料及成形加工教育部工程研究中心,合肥230009

出　　处：《粉末冶金技术》2025年第1期12-19,共8页Powder Metallurgy Technology

基　　金：国家重点研发计划资助项目(2022YFE0109700);国家自然科学基金资助项目(52274361)。

摘　　要：以偏钨酸铵和硝酸铜为原料,采用溶胶-凝胶法结合氢还原制备了Cu-20%W(质量分数)超细粉末,经压制烧结获得Cu-20W复合材料。对粉体的形貌和粒度进行表征,并考察烧结温度对Cu-20W烧结体试样组织和性能的影响。结果表明:通过溶胶-凝胶法结合氢还原可制备出平均粒度小于100 nm的Cu-20W复合粉末;随烧结温度的升高,Cu-20W烧结体试样的物理性能和力学性能提高。1080℃烧结所得试样的相对密度达97.20%,电导率(IACS)、热导率、显微硬度和抗拉强度分别达到91.73%、351.52 W·m^(−1)·K^(−1)、HV 96.1和431.03 MPa;在100~400℃温度范围内,Cu-20W试样的热膨胀系数在14.871×10^(−6)~17.422×10^(−6)·K^(−1)。Cu-20%W(mass fraction)ultrafine composite powders were prepared by the combination of sol-gel with hydrogen reduction method,using ammonium metatungstate and copper nitrate as the raw materials,and the Cu-20W samples were obtained by pressing and sintering.The morphology and particle size of the powders were characterized,and the effects of sintering temperatures on the microstructure and properties of the Cu-20W sintered samples were investigated.The results show that the Cu-20W composite powders are obtained by the combination of sol-gel with hydrogen reduction method with the average particle size of less than 100 nm.With the increase of sintering temperature,the physical and mechanical properties of the sintered Cu-20W samples are improved.The relative density of the samples sintered at 1080℃is 97.20%,the electrical conductivity(IACS),thermal conductivity,Vickers hardness,and tensile strength are reached as 91.73%,351.52 W·m^(−1)·K^(−1),HV 96.1,and 431.03 MPa,respectively.In the temperature range of 100~400℃,the coefficient of thermal expansion for the sintered Cu-20W samples is 14.871×10^(-6)~17.422×10^(-6)·K^(−1).

关 键 词：Cu-20W超细粉末 溶胶-凝胶法 烧结性能 物理性能 力学性能 

分 类 号：TG146[一般工业技术—材料科学与工程] TF123[金属学及工艺—金属材料]