Synthetic Cu(Ⅲ)from copper plating wastewater for onsite decomplexation of Cu(Ⅱ)-and Ni(Ⅱ)-organic complexes  

在线阅读下载全文

作  者:Junyi Yu Yin Cheng Anhong Cai Xianfeng Huang Qingrui Zhang 

机构地区:[1]National and Local Joint Engineering Research Center for Ecological Treatment Technology of Urban Water Pollution,College of Life and Environmental Science,Wenzhou University,Wenzhou 325035,China [2]State Key Laboratory of Metastable Materials Science and Technology,Hebei Key Laboratory of Heavy Metal Deep-Remediation in Water and Resource Reuse,School of Environmental and Chemical Engineering,Yanshan University,Qinhuangdao 066004,China

出  处:《Chinese Chemical Letters》2025年第2期470-475,共6页中国化学快报(英文版)

基  金:supported by National Natural Science Foundation of China(Nos.52170092,U22A20403 and 51808406);Hebei Natural Science Foundation(Nos.E2021203140 and B2021203016)。

摘  要:Herein,the Cu(Ⅲ)synthesized from copper plating effluent was developed for the first time to evaluate the onsite degradation performance of heavy metal complexes in the wastewater,thus achieving the purpose of“treating waste with waste”.The results indicated that synthetic Cu(Ⅲ)presented the excellent decomplexation performance for Cu(Ⅱ)/Ni(Ⅱ)-organic complexes.The removal efficiency of Cu(Ⅱ)/Ni(Ⅱ)-EDTA significantly increased with increasing Cu(Ⅲ)dosage,and the degradation of Cu(Ⅱ)/Ni(Ⅱ)-EDTA by synthetic Cu(Ⅲ)system displayed highly p H-dependent reactivity.The radical quencher experiments confirmed that Cu(Ⅲ)direct oxidation were mainly involved in the degradation of Cu(Ⅱ)-EDTA.Additionally,the continuous decarboxylation process was proven to be the main degradation pathway of Cu(Ⅱ)-EDTA in Cu(Ⅲ)system.The coexisting substances(SO42-,Cl-and fulvic acids)showed little impacts at low level for the removal of Cu(Ⅱ)/Ni(Ⅱ)-EDTA,while retarded the degradation of Cu(Ⅱ)-EDTA slightly at high level,which features high selective oxidation.Encouragingly,it was also effective to remove Cu(Ⅱ)/Ni(Ⅱ)-EDTA from in treating actual Cu/Ni-containing wastewater through synthetic Cu(Ⅲ)treatment.

关 键 词:Copper plating wastewater Cu(III) Decomplexation Treating waste with waste SELECTIVITY 

分 类 号:O641.4[理学—物理化学] X781.1[理学—化学]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象