低聚聚酰亚胺(SPI)改性的聚酰亚胺(PI)固化物的制备和性能  

Preparation and Properties of Curd Polyimide Modified by Oligomeric Polyimide

作　　者：朱国豪 陈平[1] 徐计雷 孙慧敏 ZHU Guohao;CHEN Ping;XU Jilei;SUN Huimin(State Key Laboratory of Fine Chemicals,School of Chemical Engineering,Dalian University of Technology,Dalian 116024,China)

机构地区：[1]大连理工大学化工学院精细化工全国重点实验室,大连116024

出　　处：《材料研究学报》2025年第2期103-112,共10页Chinese Journal of Materials Research

基　　金：兴辽英才计划(XLYC1802085);国家自然科学基金(51873109);大连市科技创新基金重大项目(2019J11CY007)。

摘　　要：设计并合成一种具有Cardo结构、柔性硅氧烷和苯乙炔封端的低聚聚酰亚胺(SPI),将其以不同比例混入聚酰亚胺(PI)中制备出低聚聚酰亚胺(SPI)改性的聚酰亚胺(PI)。将SPI改性的PI固化,制备出SPI改性的PI固化物,其玻璃化转变温度(Tg)从PI基体的382℃提高到459℃;拉伸强度从96.25 MPa提高到128.96 MPa,拉伸模量从1.83 GPa提高到2.41 GPa。改性PI固化物的热稳定性和力学性能优异,因为在改性固化的热交联过程中形成的半互穿聚合物网络结构(semi-IPNs)和硅氧烷结构间产生了协同效应。A novel oligomeric polyimide(SPI)incorporated with Cardo structures,flexible siloxane bonds,and phenylethynyl terminations was designed and synthesized.Then,the prepared SPI was blended with polyimide(PI)matrix in different proportions to produced SPI modified PI polymer.Upon curing,the SPI modified PI polymer exhibited significant improvements in thermal and mechanical properties.The glass transition temperature(Tg)of the cured blends increased from 382℃for the PI matrix to 459℃.Correspondingly,the tensile strength and tensile modulus were improved from 96.25 MPa and 1.83 GPa to 128.96 MPa and 2.41 GPa respectively.The enhanced thermal stability and mechanical performance of the modified PI may be attributed to the synergistic effects between the siloxane structures with the semi-interpenetrating polymer network(semi-IPNs)formed during the thermal crosslinking process.

关 键 词：有机高分子材料 聚酰亚胺 热交联 semi-IPNs结构 热稳定性 力学性能 

分 类 号：TB324[一般工业技术—材料科学与工程]