OPS/ZIF-67/PI复合材料薄膜的制备与性能  

Preparation and properties of OPS/ZIF-67/PI composite material film

作　　者：田磊 戴培邦[1] 张倍铭 TIAN Lei;DAI Peibang;ZHANG Beiming(Guangxi Key Laboratory of Information Materials,Guilin University of Electronic Technology,Guilin 541004,China)

机构地区：[1]桂林电子科技大学广西电子信息材料构效关系重点实验室,广西桂林541004

出　　处：《桂林电子科技大学学报》2024年第5期505-510,共6页Journal of Guilin University of Electronic Technology

基　　金：广西创新驱动发展专项资金项目(桂科AA18242010)。

摘　　要：集成电路的发展要求材料具有低介电常数,可通过添加纳米空洞材料降低聚合物的介电常数。以3,3′,4,4′-联苯四甲酸二酐(BPDA)、4,4′-二氨基二苯醚(ODA)合成的聚酰亚胺(PI)为基体,引入ZIF-67、OPS为纳米填料,制备ZIF-67/PI、OPS/PI、OPS/ZIF-67/PI复合材料薄膜。通过傅里叶变换红外光谱、扫描电子显微镜、X射线衍射仪对ZIF-67及上述3种复合材料薄膜进行表征,研究ZIF-67、OPS的含量对复合材料薄膜热稳定性与介电性能的影响。实验结果表明:当添加一定质量分数的ZIF-67与OPS时,OPS/ZIF-67/PI复合材料薄膜的热稳定性较PI有所下降,但是其分解温度仍大于440℃,具有较好的热稳定性;OPS/ZIF-67/PI复合材料薄膜的介电常数低于纯PI薄膜,当OPS的质量分数为5%、ZIF-67的质量分数为7%时,OPS/ZIF-67/PI复合材料薄膜的介电常数为0.69(1 kHz),相对于ZIF-67添加量为7%的ZIF-67/PI复合材料薄膜的介电常数(1.65,1kHz)下降了58.2%,相对于OPS添加量为5%的OPS/PI复合材料薄膜的介电常数(2.52,1kHz)下降了72.6%,相对于纯PI(2.98,1kHz)下降了76.8%。当添加一定质量分数的OPS与ZIF-67时,复合材料薄膜的介电损耗略微增加。The development of integrated circuits requires materials with low dielectric constant materials,and the dielectric constant of polymers can be reduced by adding nanocavity materials in.Polyimide(PI)synthesized by 3,3′,4,4′-biphenyltetracarboxylic dianhydride(BPDA)and 4,4′-diaminodiphenyl ether(ODA)was used as the matrix,and ZIF-67 and OPS were introduced as nano-fillers to prepare ZIF-67/PI,OPS/PI,and OPS/ZIF-67/PI composite films.The ZIF-67 and the above three composite films were characterized by Fourier transform infrared spectroscopy,scanning electron microscopy and X-ray diffractometer to study the effects of the contents of ZIF-67 and OPS on the thermal stability and dielectric properties of the composite films.The experimental results showed that the thermal stability of OPS/ZIF-67/PI composite films decreased compared with that of PI when a certain mass fraction of ZIF-67 and OPS were added,but their decomposition temperature was still greater than 440℃,which had good thermal stability;the dielectric constant of OPS/ZIF-67/PI composite films was lower than that of pure PI films when the mass fraction of OPS was When the mass fraction of OPS is 5%and the mass fraction of ZIF-67 is 7%,the dielectric constant of OPS/ZIF-67/PI composite film is 0.69(1 kHz),which is 58.2% lower than the dielectric constant of ZIF-67/PI composite film with 7%ZIF-67 addition(1.65,1 kHz),and the dielectric constant of OPS/PI composite film with 5%OPS addition is 58.2%lower than the dielectric constant of ZIF-67/PI composite film with 7%ZIF-67 addition.The dielectric constant of the composite film(2.52,1 kHz)decreased by 72.6% relative to that of the pure PI(2.98,1 kHz),and by 76.8% relative to that of the pure PI(2.98,1 kHz).The dielectric loss of the composite films increased slightly when a certain mass fraction of OPS with ZIF-67 was added.

关 键 词：聚酰亚胺 ZIF-67 OPS 热稳定性 介电性能 

分 类 号：TM215[一般工业技术—材料科学与工程]