基于CiteSpace的国内空投包装研究现状与趋势分析  

Analysis of Research Status and Trend of Airdrop Packaging in China Based on CiteSpace

作　　者：周卫中 秦福德 ZHOU Weizhong;QIN Fude(Jinhua Jit Packaging Co.,Ltd.,Zhejiang Jinhua 321071,China;Hankou College,Wuhan 430212,China)

机构地区：[1]金华市捷特包装有限公司,浙江金华321071 [2]汉口学院,武汉430212

出　　处：《包装工程》2025年第5期280-287,共8页Packaging Engineering

摘　　要：目的探讨国内空投包装领域的主要研究方向、发展趋势以及前沿热点。方法基于CiteSpace软件对中国知网(CNKI)数据库中有关空投包装的相关文献从发文量、作者、机构、关键词等维度进行研究现状和研究热点的可视化分析,在此基础上对未来空投包装领域的主要研究方向、发展趋势以及前沿热点进行展望。结果近20年,空投包装的研究可分为3个阶段(起步期、第1次热潮期和第2次热潮期),目前研究领域从以军事弹药空投包装为主逐渐转为重视应急救援、医疗系统等领域的空投包装研究。结论空投包装领域的研究在未来仍具有可预见的良好发展前景,主要聚焦于新型包装材料、高性能缓冲材料、应急救援空投包装和简易空投包装等热门研究。研究结果可为包装行业进一步实现转型升级、提高新质生产力提供参考和科学依据。The work aims to explore the main research direction,development trend and frontier hotspots of airdrop packaging in China.Based on CiteSpace,the relevant literature on airdrop packaging in CNKI database was analyzed visually in terms of the research status and hotspots from the number of publications,authors,institutions,key words and other dimensions,and on this basis,an outlook was made for the main research direction,development trend and frontier hotspots in the future airdrop packaging field.The research on air drop packaging in the past 20 years could be divided into three stages(the starting period,the first boom period and the second boom period),and the current research was mainly centered on the airdrop packaging of military munitions,and attention was gradually paid to the research on airdrop packaging in the fields of emergency rescue and medical systems.The research in the field of airdrop packaging still has a foreseeable good development prospect in the future,which mainly focuses on new packaging materials,high-performance cushioning materials,emergency rescue airdrop packaging and simple airdrop packaging and other popular research directions.This research can provide a reference and scientific basis for the packaging industry to further realize transformation and upgrading and improve the new quality productivity.

关 键 词：空投包装 研究现状 发展趋势 材料 结构设计 仿真 智能化 

分 类 号：TB485.1[一般工业技术—包装工程]