模块封测中FT测试失效异常处理研究  

Research on the Handling of Failure Anomalies in FT Testing during Module Packaging and Testing

作　　者：谢立松 王延斌 王晓亮 孙明霞 XIE Li-song;WANG Yan-bin;WANG Xiao-liang;SUN Ming-xia(CEC Huada Electronic Design Co.,Ltd.,Beijing Key Laboratory of RFID Chip Test Technology)

机构地区：[1]北京中电华大电子设计有限责任公司,射频识别芯片检测技术北京市重点实验室

出　　处：《中国集成电路》2025年第3期86-90,共5页China lntegrated Circuit

摘　　要：在现代电子制造产业中,模块封测是保障产品质量与提升生产效益的关键环节,FT测试(终测)作为其中核心步骤,虽能全面检测产品指标,但失效异常问题时有发生,严重影响生产。本文深入探讨FT测试失效异常,详细阐述了孤立单点失效、小范围集群失效、大规模爆发性失效等类型及表现,系统梳理了程序名称与版本管理、测试环境、封装、原材料等排查关键环节,提出异常识别与报告、分析与定位、处理措施及效果评估等异常处理方法。通过实际案例展示了小范围集群失效的处理过程,最终成功消除异常恢复生产。研究表明,深入理解失效异常类型,严格排查关键环节,采取有效处理方法,可优化生产流程、提升产品质量与产业竞争力,为电子制造产业发展提供重要参考。In the modern electronic manufacturing industry,module packaging and testing is a crucial link for ensuring product quality and enhancing production efficiency.As a core step in this process,the Final Test(FT test)can comprehensively detect product indicators.However,failure and abnormality issues occur from time to time,which seriously affect production.This paper delves deep into the failure and abnormality problems of the FT test.It elaborates in detail on the types and manifestations of various failures,such as isolated single-point failures,small-scale cluster failures,and large-scale explosive failures.It systematically sorts out the key inspection links,including the management of program names and versions,the testing environment,packaging,and raw materials.Moreover,this paper proposes methods for handling abnormalities,covering aspects such as abnormality identification and reporting,analysis and location,handling measures,and effectiveness evaluation.Through a practical case,it demonstrates the handling process of small-scale cluster failures,and finally successfully eliminates the abnormalities and restores production.The research shows that a thorough understanding of the types of failure and abnormality,strict inspection of key links,and the adoption of effective handling methods can optimize the production process,improve product quality,and enhance the competitiveness of the industry.It provides important references for the development of the electronic manufacturing industry.

关 键 词：模块封测 FT(终测) 失效异常 

分 类 号：TN407[电子电信—微电子学与固体电子学]