高导热有机硅界面复合材料研究进展  

Research progress of high thermal conductivity silicone interfacial composites

作　　者：曾邱 方洁 夏冬冬 谢谦 游胜勇[1] Zeng Qiu;Fang Jie;Xia Dongdong;Xie Qian;You Shengyong(Institute of Applied Chemistry,Jiangxi Academy of Sciences,Nanchang 330096)

机构地区：[1]江西省科学院应用化学研究所,南昌330096

出　　处：《化工新型材料》2025年第3期1-7,共7页New Chemical Materials

基　　金：江西省科学院重大产业技术攻关专项(2022YSBG10002);江西省科学院人才专项(2022YRCS001)。

摘　　要：有机硅材料因其优良的柔韧性、耐化学性、绝缘性、低黏度和耐温度性的特点广泛应用于电子领域,但其较低的导热系数阻碍了自身的应用与发展,因此高导热有机硅材料的开发是一个挑战。介绍了有机硅复合材料导热机理、导热填料种类,着重综述了目前国内外各种提高导热复合材料导热性能的方法与手段,对高导热有机硅材料的困境、研究重点方向进行了总结与展望,对高导热有机硅材料研究工作具有一定的参考和借鉴意义。Silicone materials are widely used in the field of electronics because of their excellent flexibility,chemical resistance,insulation,low viscosity and temperature resistance,but their lower thermal conductivity hinder their own application and development.Therefore,the development of high heat-conducting organic silicon materials is a challenge.This article introduced the thermal conductivity mechanism of organic silicon composite material,types of heat conduction filler,focusing on the methods and means to improve the thermal conductivity of thermal conductivity composite materials at home and abroad,summarized and looked forward to the dilemma and research key directions of high thermal conductivity organic silicon materials,offering insights and references for the further research of high thermal conductivity organic silicon materials.

关 键 词：复合材料 导热系数 有机硅 填料 

分 类 号：TQ264.1[化学工程—有机化工]