时效时间和Sb添加对Sn-9Zn-3Bi/Cu焊点界面金属间化合物生长行为的影响  

The Effect of Aging Time and Sb Addition on Growth Behavior of Interfacial Intermetallic Compounds at Sn-9Zn-3Bi/Cu Solders Joints Interface

作　　者：涂文斌[1] 胡志华 邹雨柔 刘冠鹏 王善林[1] 陈玉华[1] TU Wenbin;HU Zhihua;ZOU Yurou;LIU Guanpeng;WANG Shanlin;CHEN Yuhua(Jiangxi Key Laboratory of Forming and Joining Technology for Aerospace Components,Nanchang Hangkong University,Nanchang 330063,China;Jiangxi General Institute of Testing and Certification,Nanchang 330052,China)

机构地区：[1]南昌航空大学江西省航空构件成形与连接重点实验室,南昌330063 [2]江西省检验检测认证总院,南昌330052

出　　处：《材料导报》2025年第6期189-194,共6页Materials Reports

基　　金：江西省自然科学基金(20232BAB204052);江西省高层次高技能领军人才培养工程。

摘　　要：无铅钎料焊点界面金属间化合物是影响焊点可靠性的重要因素。本工作采用扫描电镜研究了时效时间和Sb添加对Sn-9Zn-3Bi/Cu焊点界面金属间化合物形貌及生长动力学的影响。结果表明:随着时效时间的延长,Sn-9Zn-3Bi/Cu焊点界面金属间化合物厚度逐渐增加,Sn-9Zn-3Bi/Cu焊点界面金属间化合物为γ-Cu_(5)Zn_(8)相。Sb添加会减小长时效后的Sn-9Zn-3Bi/Cu焊点界面金属间化合物厚度,其生长系数从0.67μm/h^(1/2)降至0.56μm/h^(1/2)。随着时效时间延长至168 h,焊点界面金属间化合物除了γ-Cu_(5)Zn_(8)相外,还会在靠近Cu基板处形成Cu_(6)Sn_(5)相和靠近钎料侧形成扩散反应层,Sb元素会扩散到焊点界面处Cu_(6)Sn_(5)相中,以固溶体形式存在。The intermetallic compounds(IMC)at the interface of lead-free solder joints play a key role in affecting the reliability of the solder joints.In this work,the effects of aging time and Sb addition on the morphology of IMC and corresponding growth kinetics of the Sn-9Zn-3Bi/Cu solder joint were studied by scanning electronic microscope(SEM).The results show that the thickness of the interfacial IMC at the Sn-9Zn-3Bi/Cu solder joint increase as the aging time increase,and the type of IMC wasγ-Cu_(5)Zn_(8)phase.After long period of aging,the addition of Sb reduced the thickness of the interface IMC at the Sn-9Zn-3Bi/Cu solder joint,and the growth coefficient of the IMC decreases from 0.67μm/h^(1/2)to 0.56μm/h^(1/2).As the aging time increases to 168 h,except for the existence of the interfacialγ-Cu_(5)Zn_(8)phase,the Cu_(6)Sn_(5)phase is formed near Cu substrate,and the diffusion interaction layer is formed near solder matrix too.The Sb element will diffuse into the Cu_(6)Sn_(5)phase and exist in the form of solid solution.

关 键 词：时效时间 Sb添加 Sn-9Zn-3Bi钎料 界面组织 生长系数 

分 类 号：TG453.9[金属学及工艺—焊接]