The impact of sidewall copper grain condition on thermo-mechanical behaviors of TSVs during the annealing process  

作　　者：Yang Xi Yunpeng Zhang Zhiqaing Tian Tianjian Liu Can Sheng Bo Zhao Zhaofu Zhang Shizhao Wang Sheng liu 

机构地区：[1]The Institute of Technological Sciences,Wuhan University,Wuhan 430072,China [2]School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China [3]School of Power and Mechanical Engineering,Wuhan University,Wuhan 430072,China

出　　处：《Microsystems & Nanoengineering》2024年第6期545-558,共14页微系统与纳米工程(英文)

基　　金：supported by the Major Program(JD)of Hubei Province(No.2023BAA008);the National Key R&D Program of China(No.2022YFB3207100);the Hubei Provincial Strategic Scientist Training Plan(No.2022EJD009);the Fundamental Research Funds for the Central Universities(No.2042023kf1041).

摘　　要：With the drastic reduction of the TSV diameter leading to a critical dimension comparable to the Cu-filled grain size,the grain condition strongly influences the thermo-mechanical behavior of the TSV.In this work,the TSV-Cu cross-section with different grain sizes is characterized by EBSD,confirming that the sidewall grain size(0.638–1.580μm)is smaller compared to other regions(1.022–2.134μm).A finite element model(FEM)considering copper grains is constructed by using Voronoi diagrams to investigate the effect of sidewall grain size as well as area on the thermo-mechanical behavior during annealing.The material parameters in the FEM are optimized through nanoindentation inversion and considering the mechanical property anisotropy of copper grains.The yield strengthσy and hardening exponent n of TSV-Cu are 74.6 MPa and 0.514.The simulation results indicate that the protrusion of TSV-Cu after annealing tends to increase initially and then decrease with smaller sidewall grain size and area.The maximum increase in protrusion caused by the two variables can reach 6.74%and 14.6%,respectively,relative to the average grain condition.Additionally,the simulation results were validated by quantifying grain boundaries in TSV-Cu samples with varying grain sizes.

关 键 词：GRAIN COPPER ANNEALING 

分 类 号：TN305[电子电信—物理电子学]