高温高湿下导电胶黏剂老化失效机理研究  

Study on the Aging Failure Mechanism of Isotropic Conductive Adhesive Under High Temperature and Humidity

作　　者：张新兰[1] 许文[1] 梁晓凡[1] 丁孝均[1] 张欢[1] ZHANG Xinlan;XU Wen;LIANG Xiaofan;DING Xiaojun;ZHANG Huan(Aerospace Research Institute of Materials&Processing Technology,Beijing 100076)

机构地区：[1]航天材料及工艺研究所,北京100076

出　　处：《宇航材料工艺》2025年第1期108-113,共6页Aerospace Materials & Technology

摘　　要：对高温高湿下硅橡胶导电胶黏剂的老化失效机理进行了研究,并通过扫描电镜(SEM)、电化学阻抗谱仪(EIS)、X射线光电子能谱(XPS)等表征手段对材料老化前后的微观结构进行了表征。结果表明,在高温高湿下,由于胶黏剂后固化收缩、黏结界面强度的降低及与被黏结材料热膨胀系数的差异,使得黏结界面处产生微裂纹,并随时间扩展。而在相同老化温度、老化时间下,湿度的存在促进了黏结界面处微裂纹的形成与扩展。XPS结果表明材料经高温高湿老化后,试样表面的“无机硅”比例显著增加。The aging failure mechanism of isotropic conductive adhesive under high temperature and humidity was studied.The microstructure of the material before and after aging was characterized by scanning electron microscope(SEM),electrochemical impedance spectroscopy(EIS)and X-ray photoelectron spectroscopy(XPS).The results show that under high temperature and high humidity,due to the post-curing shrinkage of the adhesive,the decrease in the bonding interface strength,and the difference in the thermal expansion coefficient with the bonded material,microcracks are generated at the bonding interface and expand with time.Under the same aging temperature and aging time,the presence of humidity promotes the formation and expansion of microcracks at the bonding interface.XPS results show that after aging under high temperature and high humidity,the proportion of"inorganic silicon"on the surface of the sample significantly increases.

关 键 词：导电胶黏剂 高温高湿 失效机理 

分 类 号：TB324[一般工业技术—材料科学与工程]