晶圆级芯片表面电沉积镍钨合金初期探索性研究  

Preliminarystudy on electroplating of nickel-tungsten alloys on wafer-level chips

作　　者：吴王平[1] 安宇澳 黎鑫 汪涛[1] 焦严涛 Wu Wangping;An Yuao;Li Xin;Tao Wang;Yantao Jiao(Changzhou University,School of Mechanical and Rail Transit,Changzhou 213164,China)

机构地区：[1]常州大学机械与轨道交通学院,江苏常州213164

出　　处：《电镀与精饰》2025年第3期26-33,共8页Plating & Finishing

摘　　要：针对晶圆级芯片表面电沉积钨合金技术展开探索性研究,旨在改善电沉积过程中镀层质量差、钨含量低等问题,以提升其在高性能半导体器件中的应用潜力。研究以镍钨合金为对象,因其优异的高温稳定性和机械性能,被认为是芯片制造中互连层与阻挡层材料的潜在选择。然而,现有技术在芯片表面形成高质量镀层时存在诸多限制。本研究通过调整电解液配方、电流密度和温度等参数,系统研究这些工艺参数对沉积层质量的影响。采用扫描电子显微镜(SEM)和X射线能谱(EDS)对沉积层的表面形貌和元素组成进行表征,以评估其微观结构质量和成分比例,并通过X射线衍射(XRD)分析晶体结构。同时,通过显微硬度测试不同参数下沉积层的硬度,从而评价其机械性能。结果表明,电沉积参数显著影响镍钨合金沉积层的质量;合理调整工艺参数可获得表面平整、致密且硬度高的沉积层,并有效提升钨的含量。本研究为优化电沉积镍钨合金工艺、制备高性能芯片互连层和阻挡层材料提供了重要参考。This study conducts an exploratory investigation into the electroplating of tungsten alloys on wafer-level chip surfaces,aiming to address challenges such as low coating quality and inadequate tungsten content during deposition,ultimately enhancing their potential use in high-performance semiconductor devices.Nickel-tungsten(Ni-W)alloy was chosen as the focus of this study due to its exceptional high-temperature stability and mechanical properties,making it a promising candidate for interconnect and barrier layers in chip manufacturing.However,existing electroplating techniques face significant limitations in achieving high-quality coatings on chip surfaces.This study systematically investigates the effects of varying electrolyte composition,current density,and temperature on the quality of Ni-W alloy deposition layers.Scanning electron microscopy(SEM)and X-ray energy dispersive spectroscopy(EDS)were employed to analyze the surface morphology and elemental composition of the deposited layers,providing insights into microstructural quality and compositional ratios.X-ray diffraction(XRD)was used to evaluate crystal structure.Additionally,microhardness testing was conducted to assess the mechanical performance of the layers under different parameter settings.Results indicate that deposition parameters significantly impact the surface quality of Ni-W alloy coatings.By adjusting the process parameters,deposition layers with smooth surfaces,high density,and enhanced hardness can be achieved.This study provides valuable insights for optimizing the electroplating process of Ni-W alloys,contributing to the development of high-performance interconnect and barrier materials for semiconductor chips.

关 键 词：电沉积 钨合金 晶圆级芯片 

分 类 号：TQ153.2[化学工程—电化学工业]