粗化预电镀引线框架的可靠性研究  

Research on the reliability of roughen pre-electroplated lead frame

作　　者：张德良 朱林 郑浩帅 杨永学 黄伟 Zhang Deliang;Zhu Lin;Zheng Haoshuai;Yang Yongxue;Huang Wei(Henghui Technology Co.,Ltd.,Zibo 255000,China)

机构地区：[1]新恒汇电子股份有限公司,山东淄博255000

出　　处：《电镀与精饰》2025年第3期67-72,共6页Plating & Finishing

摘　　要：使用自主研发的电镀粗镍用电镀液,制备了粗化预电镀引线框架产品,并对产品粗化度的影响因素进行了研究,最终量化了粗化度与可靠性之间的关系。研究结果表明,电镀液中的主盐及微结构剂含量、电流密度、镀镍层厚度是影响预电镀引线框架表面粗化度的关键因素,将框架表面粗化度S-ratio控制在≥1.2,能够保证粗化预电镀引线框架的可靠性,该研究有望推动实现该类产品的国产化替代。A self-developed electroplating solution was used to prepare roughened pre-electroplated lead frames,the factors that affecting the roughness of the products was studied,and finally,the relationship between roughness and reliability was investigated.The research results indicate that the main salt and microstructure agent content in the electroplating solution,current density,and thickness of nickel layer are key factors affecting the surface roughness of pre-electroplated lead frames.Controlling the surface roughness S-ratio above 1.2 could ensure the reliability of roughened pre-electroplated lead frames,which is expected to promote the localization and substitution of such products.

关 键 词：电镀粗镍 电镀液 引线框架 粗化度 可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]