铜箔类型对PCB棕化处理的影响  

The influence of copper foil type on PCB brown oxide process

作　　者：付海涛 王建彬 杨威 Fu Haitao;Wang Jianbin;Yang Wei(Shanghai Meadville Science&Technology Co.,Ltd.,Shanghai 201613,China;Shanghai Meadville Electronics Co.,Ltd.,Shanghai 201600,China)

机构地区：[1]上海美维科技有限公司,上海201613 [2]上海美维电子有限公司,上海201600

出　　处：《电镀与精饰》2025年第3期73-76,共4页Plating & Finishing

摘　　要：在印制电路板(Printed Circuit Board,PCB)生产过程中,在线路完成制作后和层压处理前,对线路表面进行棕化处理,以增加印制电路板线路与介电层(半固化片)之间的结合力。主要研究铜箔类型对印制电路板棕化处理的影响,结果显示:在PCB生产过程中,压延铜箔和电解铜箔在经过棕化处理后的表面存在明显差异,电解铜箔表面经过棕化处理后均匀性好,剥离强度高,产品不易分层;压延铜箔因部分晶粒扁平且整体均匀性差,因此棕化处理后表面有明显差异,剥离强度低,部分区域与低流动度的半固化片结合力不足而分层。通过调整棕化参数,增加压延铜箔与低流动度的半固化片结合力,可解决分层问题。This paper mainly studies the influence of copper foil type on printed circuit board(PCB)brownoxide process.The results show that:in PCB production process,the surface of electro-deposited(ED)copper foil and rolled annealed(RA)copper foilhave obvious differences in the brown oxide process.After the surface of ED copper foil is browned oxide,the uniformity is good,the peeling strength is high,and the product is not easy to bedelaminated.Due to the flat grain and poor overall uniformity of RA copper foil,the surface of RA copper foil is obviously different,the peeling strength is low,and some areas are delaminated because of insufficient peel strength with no flow prepreg(PP).By adjusting the brown oxide parameters,the peel strength between RA copper foil and No flow PP is increased to solve the delamination problem.

关 键 词：PCB 压延铜箔 电解铜箔 棕化 分层 

分 类 号：TN41[电子电信—微电子学与固体电子学]