热处理对粉末触变成形50Si/Al-1Mg复合材料组织及性能的影响  

Effects of Heat Treatment on Microstructure and Properties of Powder Thixoforming 50Si/Al-1Mg Composites

作　　者：张海涛[1] 阎峰云[1,2] 张燕强 ZHANG Haitao;YAN Fengyun;ZHANG Yanqiang(State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals,Lanzhou University of Technology,Lanzhou 730050;Research Center of Nonferrous Metal and Composites of Gansu Province,Lanzhou 730050;Western Heavy Industry Co.,Ltd.of JISCO,Jiayuguan 735100)

机构地区：[1]兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,兰州730050 [2]甘肃省有色金属及复合材料工程研究中心,兰州730050 [3]甘肃酒钢集团西部重工股份有限公司,嘉峪关735100

出　　处：《特种铸造及有色合金》2025年第2期235-241,共7页Special Casting & Nonferrous Alloys

基　　金：甘肃省重大科技专项资助项目(ZX1406);甘肃省科技专员专项资助项目(22CX8GA116)。

摘　　要：采用粉末触变成形工艺制备了电子封装用50Si/Al-1Mg复合材料,通过测定其热导率、热膨胀系数、抗弯强度及维氏硬度,研究了T6热处理对复合材料微观组织、力学性能以及热物性能的影响。结果表明,粉末触变成形工艺可制备出Si颗粒分布均匀,组织致密的Si/Al复合材料;在不同温度下进行固溶处理后,发现随着固溶温度升高,复合材料组织中大尺寸Si颗粒逐渐长大,小尺寸Si颗粒和第二相溶解消失;经170℃×6 h时效后,复合材料的抗弯强度和硬度(HV)达到了387.55 MPa和256,比原始态分别提升了16.2%和7.43%,而热导率变化不大。50Si/Al-1Mg composites for electronic encapsulation were prepared by powder thixoforming process,and effects of T6 heat treatment on microstructure,mechanical properties and thermophysical properties of the composites were investigated by determining the thermal conductivity,coefficient of thermal expansion,flexural strength and Vick⁃ers hardness.The results indicate that the powder thixoforming process can prepare Si/Al composites with uniform dis⁃tribution of Si particles and dense structure.After solid solution treatment at different temperatures,the large-sized Si particles grow gradually with the increase of solid solution temperature,and the small-sized ones as well as the second phase are dissolved and finally disappear.After aging at 170℃for 6 h,the flexural strength and hardness of composites reach 387.55 MPa and 256 HV,which are 16.2%and 7.43%higher than those of primary specimens,respectively,while the thermal conductivity has little change.

关 键 词：粉末触变成形 50Si/Al复合材料 热处理 抗弯强度 

分 类 号：TB331[一般工业技术—材料科学与工程] TG146.21[金属学及工艺—金属材料]