金相显微剖切技术研究  

Study on Cross Section Technology

作　　者：潘登科 张宣 李晓倩 汪洋 钱雨鑫 PAN Dengke;ZHANG Xuan;LI Xiaoqian;WANG Yang;QIAN Yuxin(CEPREI-EAST,Suzhou 215129,China;Ningbo CEPREI IT Research Institute Co.,Ltd.,Ningbo 315040,China)

机构地区：[1]工业与信息化部电子第五研究所华东分所,江苏苏州215000 [2]宁波赛宝信息产业技术研究院有限公司,浙江宁波315040

出　　处：《电子产品可靠性与环境试验》2025年第1期17-22,共6页Electronic Product Reliability and Environmental Testing

摘　　要：金相显微剖切技术是一种在工业产品质量检测领域应用得较为广泛的检验检测手段,具有检测速度快、检测结果直观的特点。金相显微剖切技术虽然在不同样品的制样步骤上大体一致,均为切割、镶嵌、研磨、抛光、观察,但是在具体步骤实施过程中采取的手段和方法上大不相同。对金相显微剖切技术制样的步骤进行了具体介绍,并对金相显微剖切技术的实际应用进行了详细的阐述。Cross section technology is a inspection and testing method widely used in the field of industrial product quality inspection,and it has the characteristics of fast detection speed and intuitive detection results.Although the preparation steps of cross section technology are generally consistent in different samples,including cutting,inlaying,grinding,polishing,and observation,the means and methods used in the specific steps are greatly different.The steps of cross section technology is introduced in detail,and the practical application of cross section technology is described in detail.

关 键 词：金相显微剖切技术 印制电路板 金属产品 涂镀层 

分 类 号：TN707[电子电信—电路与系统]