QFN器件侧面预上锡焊端分层失效分析研究  

Analysis and Study of Delamination Failure of Pre-soldered Ends on the Side of QFN Devices

作　　者：黄益军 陈海峰 魏斌 周亚丽 李靖 柯望 马诗行 HUANG Yijun;CHEN Haifeng;WEI Bin;ZHU Yali;LI Jing;KE Wang;MA Shihang(The 58th Research Institute of CETC,Wuxi 214072,China;Wuxi Zhong Wei High-tech Electronies Co.,Ltd.,Wuxi 214072,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214072 [2]无锡中微高科电子有限公司,江苏无锡214072

出　　处：《电子产品可靠性与环境试验》2025年第1期23-27,共5页Electronic Product Reliability and Environmental Testing

摘　　要：针对采用手工电烙铁给塑封方形扁平无引脚封装(QFN)器件侧面裸铜焊端预上锡后出现的分层缺陷进行了分析和研究。运用正交试验设计法,设计了9种不同的组合进行预上锡试验,并对试验结果进行了极差分析。研究结果表明电烙铁预上锡温度对QFN器件分层问题有显著的影响。同时,从封装工艺和预上锡工艺等方面各提出了一种解决方案,可以有效地规避分层问题。The delamination defect that occurs after pretinning the bare copper solder end on the side of a plastic sealed quad flat no-lead package(QFN)device using a manual soldering iron is analyzed and studied.Using orthogonal experimental design method,9 different combinations are designed for pretinning experiments,and range analysis is conducted on the experimental results.The research results indicate that the pretinning temperature on the electric soldering iron has a significant impact on the delamination problem of QFN devices.At the same time,a solution is proposed respectively from two aspects of packaging process and the pretinning process,which can effectively avoid the layering problem.

关 键 词：方形扁平无引脚封装 侧面爬锡 预上锡工艺 焊端分层 热应力 热膨胀系数不匹配 

分 类 号：TN605[电子电信—电路与系统]