低阻抗搭接工艺技术应用与研究  

Application and Research of Low Impedance Lapping Technology

作　　者：王志洪 朱兆哲 马永章 朱景磊 刘凌峰 鲁昊 WANG Zhi-hong;ZHU Zhao-zhe;MA Yong-zhang;ZHU Jing-lei;LIU Ling-fen;LU Hao(The 52nd Research Institute of China Electronics Technology Group Corporation,Hangzhou 311121)

机构地区：[1]中国电子科技集团公司第五十二研究所,杭州311121

出　　处：《环境技术》2025年第2期41-46,共6页Environmental Technology

摘　　要：为控制电子设备电磁环境效应,满足工作性能要求,针对目前搭接电阻要求高、搭接方式不稳定等问题进行系统研究,提出一种长期可靠的搭接加固技术。通过案例分析总结,从材料、距离、搭接面积、接触压力、安装工艺五个方向进行测试研究,获取各个影响因素权重。结合实际案例进行新搭接加固技术验证,可明显提高电子设备的抗恶劣环境能力,对有较高搭接要求的电子设备具有一定指导意义。In order to control the electromagnetic environmental effects of electronic equipment and meet the performance requirements,a systematic study was conducted on the current high requirements for lap resistance and unstable lap methods,so a long-term and reliable lap reinforcement technology was proposed.Through case analysis and summary,testing and research were conducted from five aspects:material,distance,overlap area,contact pressure,so that the weight of each influence factor was obtained.By combining practical cases to validate the new lap reinforcement technology,the ability of electronic equipment to withstand harsh environments could be significantly improved.This study had guiding significance for electronic devices with high lap resistance requirements.

关 键 词：电子设备 搭接电阻 加固技术 抗恶劣环境 

分 类 号：TB31[一般工业技术—材料科学与工程]