h-BN对超低介电损耗COC/h-BN复合材料导热性能、介电性能的影响  

Effect of h-BN on the thermal conductivity and dielectric properties of ultra-low dielectric loss COC/h-BN composites

作　　者：钱康乐 彭海益 何代华[1] 姚晓刚[2] 林慧兴[2] QIAN Kangle;PENG Haiyi;HE Daihua;YAO XiaoGang;LIN huixing(School of Materials and Chemistry,University of Shanghai for Science and Technology,Shanghai 200093,China;Shanghai Institute of Ceramics,Chinese Academy of Sciences,Shanghai 201899,China)

机构地区：[1]上海理工大学材料与化学学院,上海200093 [2]中国科学院上海硅酸盐研究所,上海201899

出　　处：《有色金属材料与工程》2025年第1期67-74,共8页Nonferrous Metal Materials and Engineering

基　　金：国家自然科学基金资助项目(52302122)。

摘　　要：采用双螺杆造粒和热压成型技术制备了含不同体积分数(10%~30%)和不同粒径(10、25μm)六方氮化硼(hexagonal boron nitride,h-BN)的环烯烃类共聚物(cycloolefin copolymer,COC)/h-BN(COC/h-BN)高导热微波复合材料。通过扫描电子显微镜、矢量网络分析仪和热膨胀仪研究了其微观结构、微波介电性能和热性能。结果显示,相比COC/h-BN-10复合材料,COC/h-BN-25复合材料具有更高的密度和更好的导热性能。在h-BN体积分数达到30%时,COC/h-BN-25复合材料在X/Y方向的导热系数达到0.766 W/(m·K),Z方向的为1.204 W/(m·K),同.时介电损耗低。The microwave composites with high thermal conductivity of cycloolefin copolymer(COC)/hexagonal boron nitride(h-BN)(COC/h-BN)with different volume fractions(10%-30%)and different particle sizes(10,25μm)h-BN were prepared by using twin-screw granulation and hot pressing technology.The microstructure,microwave dielectric properties and thermal properties of the composites were studied by scanning electron microscopy,vector network analyzer and thermal dilatometer.The results show that the COC/h-BN-25 composite has higher density and thermal conductivity than that of the COC/h-BN-10 composite.When the volume fraction of h-BN is 30%,the thermal conductivities of the COC/h-BN-25 composite reaches 0.766 W/(m·K)in the X/Y direction and 1.204 W/(m·K)in Z direction,with low dielectric loss.

关 键 词：粒径 六方氮化硼 导热性能 介电性能 环烯烃类共聚物 

分 类 号：TB332[一般工业技术—材料科学与工程]