生瓷片覆膜工艺关键技术  

Key Technologies of Film Covering on Green Ceramic Tape

作　　者：庄园 ZHUANG Yuan(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,太原030024

出　　处：《电子工艺技术》2025年第2期35-37,41,共4页Electronics Process Technology

摘　　要：通过系统解析LTCC覆膜工艺的流程特征及技术瓶颈,重点突破生瓷片覆膜过程中的叠层精度控制、界面结合强度优化等关键技术,显著提升了膜层均匀性与图形对准精度,最终形成具备工程应用价值的高可靠性覆膜解决方案。研究通过系统性技术攻关实现了关键工艺指标的突破,为LTCC器件微互连技术的创新发展提供了重要技术支撑。The process characteristics and technical bottlenecks of LTCC film covering process are systematically analyzed,and the key technologies such as the control of stacking precision and the optimization of interface bonding strength in the film covering process are emphasized,which significantly improves the uniformity of the film and the precision of pattern alignment.Finally,a high-reliability film covering solution with engineering application value is formed.The research has achieved the breakthrough of key process indicators through systematic technical research,which provides an important support for the innovation and development of micro-interconnection technology of LTCC devices.

关 键 词：生瓷片 覆膜 精度 

分 类 号：TN605[电子电信—电路与系统]