晶圆键合加压精度控制技术  

Precision Control Technology of Wafer Bonding Pressure

作　　者：李安华 李文浩 郭静枫 LI Anhua;LI Wenhao;GUO Jingfeng(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,太原030024

出　　处：《电子工艺技术》2025年第2期42-44,共3页Electronics Process Technology

基　　金：国家重点研发计划资助项目(2022YFB3404303)。

摘　　要：为解决晶圆键合加压精度控制问题,提高键合质量水平,以伺服电机驱动电动缸加压系统为例进行研究。重点对压力传感器实时反馈与ARM控制器闭环控制技术进行分析,阐述在晶圆键合过程中的应用效果,并以此为基础提出柔性力自平行加压结构设计建议,通过系统化试验的方式进行研究。结果表明:该控制方法具有优异的加压精度控制能力,位移控制精度可达±1%,键合力控制精度达到±0.5%,研究结果具有较强的实用性,能够为半导体器件制造工艺提供参考。In order to solve the problem of precision control in wafer bonding pressure and improve the bonding quality,a servo motor driven electric cylinder pressurization system is studied.The research focuses on analyzing the real-time feedback of pressure sensors and the closed-loop control technology of ARM controllers,elaborating on their application effects in wafer bonding processes.Based on this,the design suggestion of flexible self-parallel compression structure is put forward and studied by systematic test.The results show that this control method has excellent pressure accuracy control capability,with displacement control precision up to±1%and bonding force control precision up to±0.5%.The research results have strong practicality and can provide reference for semiconductor device manufacturing processes.

关 键 词：晶圆键合 加压 精度控制 

分 类 号：TN305[电子电信—物理电子学]