应用于阳极氧化基板封孔改性的热固性树脂聚合物  

Thermosetting resin polymers for sealing modification of anodized substrates

作　　者：潘林铮 罗炜杰 周继军[1] PAN Linzheng;LUO Weijie;ZHOU Jijun(Sohool of Electronics and Information Engineeing,Hangzhou Dianzi University,Hangzhou 310018,China;College of Information Engineering Hangzhou Dianzi University,Hangzhou 310018,China)

机构地区：[1]杭州电子科技大学电子信息学院,浙江杭州310018 [2]杭州电子科技大学信息工程学院,浙江杭州310018

出　　处：《热固性树脂》2025年第1期47-50,55,共5页Thermosetting Resin

摘　　要：制备了不同配比的聚合物封孔溶胶对LED灯阳极氧化基板进行封孔,并将其性能测试结果与传统的化学封孔法进行对比。结果表明,使用F51型环氧树脂与纳米ZnO为主体材料配制封孔溶胶配合高温固化,可在提升阳极氧化基板的力学性能与耐电压强度的同时保持其导热性能。封孔处理后基板涂层硬度达到5H,附着力为1级,整板耐电压强度为52.33 V/μm,导热系数为35.9 W/(m·K)。同时研究发现添加适量的纳米ZnO作为填料能够提高涂层表面均匀度,减少缺陷的产生。优化后的封孔方案在提高基板性能和维持导热性能方面表现优异。The polymer sealing sols with different ratios were prepared to seal the anodized substrate for LED lamp,and the property test results were compared with the traditional chemical sealing method.The results showed that using F51 epoxy resin and nano-ZnO as the main material to prepare the sealing sol with high temperature curing could improve the mechanical properties and dielectric strength of the anodized substrate while maintaining its thermal conductivity.After sealing treatment,the hardness of the substrate coating reached 5 H,the adhesion was grade 1,the dielectric strength of the whole plate was 52.33 V/μm,and the thermal conductivity was 35.9 W/(m·K).It was also found that adding an appropriate amount of nano-ZnO as a filler could improve the uniformity of the coating surface and reduce the generation of defects.The optimized sealing scheme had excellent performance in improving substrate performance and maintaining thermal conductivity.

关 键 词：环氧树脂 阳极氧化膜 封孔 导热 耐电压 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]