2.5D C_(f)/SiC复合材料与SiC陶瓷微磨削性能对比试验研究  

Comparative Experimental Study on Micro-grinding Performance of 2.5D C_(f)/SiC Composites and SiC Ceramics

作　　者：巩亚东[1] 李远峰 温泉[1] 任启震 GONG Ya-dong;LI Yuan-feng;WEN Quan;REN Qi-zhen(School of Mechanical Engineering&Automation,Northeastern University,Shenyang 110819,China.)

机构地区：[1]东北大学机械工程与自动化学院,辽宁沈阳110819

出　　处：《东北大学学报(自然科学版)》2025年第1期52-60,共9页Journal of Northeastern University(Natural Science)

基　　金：国家自然科学基金资助项目(U1908230).

摘　　要：为探究2.5D C_(f)/SiC复合材料与SiC陶瓷的微尺度磨削过程,对比2种材料在同一工艺参数下表面显微形貌、表面粗糙度与磨削力的差异,并分析工艺参数变化对磨削性能评价参数的影响;采用直径为0.9 mm的500#电镀金刚石微磨具对2种材料分别进行单因素微磨削试验.结果表明,2.5D C_(f)/SiC复合材料去除过程不同于SiC陶瓷,这是因为复合材料增强纤维的存在,有效抑制了微磨削过程中裂纹的扩展;在同一工艺参数下,2.5D C_(f)/SiC复合材料表面微观形貌较好、缺陷少、表面粗糙度小,而无纤维增强的SiC陶瓷表面微观形貌较差、缺陷多、表面粗糙度大;SiC陶瓷的平均磨削力大于2.5D C_(f)/SiC,并且在微磨削过程中,2.5D C_(f)/SiC的实时磨削力信号较平稳,而SiC陶瓷的实时磨削力信号存在尖刺.In order to explore the micro‑grinding process of 2.5D C_(f)/SiC composites and SiC ceramics,the differences of surface morphology,surface roughness and grinding force between the two materials under the same process parameters were compared,and the influence of process parameters on grinding performance evaluation parameters was analyzed.Single‑factor micro‑grinding experiments were carried out on the two materials by using 500#electroplated diamond micro‑grinding tools with the diameter of 0.9 mm.The results showed that the removal process of 2.5D C_(f)/SiC composites is different from that of SiC ceramics because the composites effectively inhibit the propagation of cracks during micro‑grinding.Under the same process parameters,2.5D C_(f)/SiC composites have better surface micro‑morphology,fewer defects and less surface roughness,while SiC ceramics without fiber reinforcement have worse surface micro‑morphology,more defects and greater surface roughness.The average grinding force of SiC ceramics is more than 2.5D C_(f)/SiC,and the real‑time grinding force signal of 2.5D C_(f)/SiC is relatively stable during micro‑grinding,while the real‑time grinding force signal of SiC ceramics has spikes.

关 键 词：2.5D C_(f)/SiC复合材料 SIC陶瓷 微磨削过程 表面微观形貌 表面粗糙度 磨削力 

分 类 号：TH161[机械工程—机械制造及自动化]