喷锡PCBA防炸锡结构的研究与应用  

Research and Application of Anti-Spattering Tin Structure for Tin-Sprayed PCBA

作　　者：耶明 卞新宇 

机构地区：[1]格力电器(合肥)有限公司,合肥230088

出　　处：《日用电器》2025年第2期57-61,共5页ELECTRICAL APPLIANCES

摘　　要：PCB(印制线路板)是电子行业的基本组成部分,和电子元器件结合可以实现各种所需的电路功能。电子设备在运行过程所消耗的电能,比如射频功放、FPGA芯片、电源类产品,除了有用功外,大部分都需要转化成热量进行散发,电子设备产生的热量,使内部温度迅速上升,如果不及时将该热量散发出去,设备将会继续升温,器件就可能因过热而失效,也会减少电路板的使用寿命,因此,对PCBA的散热方式研究十分重要。本文主要对喷锡板散热方式及过孔开窗方式进行研究,进一步提高喷锡PCBA焊接质量的可靠性。PCB(Printed Circuit Board)is a fundamental component of the electronic circuit industry.Combined with electronic components,it can achieve various required circuit functions.The electrical energy consumed by electronic devices during operation,such as radio-frequency power amplifiers,FPGA chips,and power-supply-type products,mostly needs to be converted into heat for dissipation except for useful work.The heat generated by electronic devices causes the internal temperature to rise rapidly.If this heat is not dissipated in a timely manner,the equipment will continue to heat up,and components may fail due to overheating,reducing the service life of the circuit board.Therefore,the thermal design of PCBA is of great importance.This paper mainly studies the heat-dissipation methods of tin-sprayed boards and the via-opening methods to further improve the reliability of the welding quality of tin-sprayed PCBA.

关 键 词：喷锡PCBA 散热方式 斑马线开窗 防炸锡 

分 类 号：TN4[电子电信—微电子学与固体电子学]