叠层片式热敏电阻表面绝缘处理技术的研究进展  

Research progress on surface insulation treatment technology of multilayer chip thermistor

作　　者：程飞鹏 文昕 向艳 辜丽欢 CHENG Feipeng;WEN Xin;XIANG Yan;GU Lihuan(Chengdu Hongming Electronics Co.,Ltd.,Chengdu 610000,China)

机构地区：[1]成都宏明电子股份有限公司,四川成都610000

出　　处：《电子元件与材料》2025年第1期110-119,共10页Electronic Components And Materials

摘　　要：微电子技术的发展和对电子产品微型化的需求引领着热敏电阻朝着小型化、高可靠性的方向发展,对热敏电阻的材料及封装技术也提出了更高的要求。表面绝缘化处理是影响叠层片式热敏电阻封装尺寸及可靠性的关键工艺,然而传统的玻璃喷涂工艺难以适应小尺寸元件的生产。为此针对叠层片式热敏电阻为抑制电镀时产生爬镀、降低镀液侵蚀的风险及提高环境耐受性而常用的几种表面绝缘处理技术进行了调研,对近年来片式元件行业厂商广泛使用的喷涂、印刷、沉积、浸渍工艺进行综述,从生产成本及效率、环境保护等方面对比分析了各工艺特点。同时从绝缘材料本身特点剖析,为相应工艺的匹配提供了理论支撑。最后,分析了叠层片式热敏电阻表面绝缘处理工艺发展所面临的挑战,并从高效环保的浸渍工艺优化、高性能耐高温材料研发及现有工艺创新升级等方面,探讨了未来的发展方向。The development of microelectronics technology and compactness of electronic products lead the development of thermistors towards miniaturization and high reliability,which imposes stringent requirements on the materials and packaging technologies.Surface insulation treatment is the critical process that affects the packaging size and reliability of the multilayer chip thermistors.However,traditional glass spraying technology is difficult to be adapted for fabricating small-sized components.This review surveys several commonly used surface insulation treatment techniques for multilayer chip thermistors to prevent crawling plating,reduce electrolyte erosion,and improve environmental resistance.A comprehensive review is presented for the widely used processes in the chip component industry,including spraying,printing,deposition,and dipping.The characteristics of each process are compared and analyzed from the aspects of production cost,efficiency,and environmental impact.From the analysis of the intrinsic properties of insulating materials,it provides the foundation for matching appropriate processes.Finally,the challenges are analyzed for the development of surface insulation processes of multilayer chip thermistors.Future development directions are discussed from the perspectives of efficiency and environmentally friendly impregnation processes,high-performance high-temperature resistant materials,and optimization of existing processes and technological innovations.

关 键 词：叠层片式热敏电阻 表面处理 综述 绝缘 抑制爬镀 

分 类 号：TN371[电子电信—物理电子学]