Air-Sintering of Dual-Ligand Capped Copper Nanoparticles for High-Temperature Interconnect Applications  

作　　者：Yu-Ji Zheng Jun-Jie Yuan Qing-Hua Li Zhe-Fei Sun Heng-Hui Wang Xiang Wu Ti-Xun Li Zi-Yu Zhou Shi-Yu Xia Jin-Tang Li Hui-Jun Cao Wen-Zhi Cai Jonghwan Suhr Zhi-Hao Zhang 

机构地区：[1]Fujian Key Laboratory of Advanced Materials,Department of Materials Science and Engineering,College of Materials,Xiamen University,Xiamen,China [2]School of Transportation Engineering,Xiamen City University,Xiamen,China [3]Department of Polymer Science and Engineering,School of Mechanical Engineering,Sungkyunkwan University,Suwon,South Korea

出　　处：《cMat》2025年第1期26-38,共13页铜新材(英文)

基　　金：supported by the Natural Science Foundation of Fujian Province(No.2022J01044);the Digital Twin and Intelligent Transportation Maintenance Engineering Research Centre of Genting Applied Technology R&D Platform at Xiamen City University。

摘　　要：Copper nanoparticles(CuNPs)have promising applications in energy storage,sensing,and chip manufacturing because of their excellent properties and low cost.However,oxidation limits their sinterability and performance at high temperatures.Here,dual-ligand CuNPs with oleylamine and ethylenediamine were synthesized and optimized.The results confirm that the dual-ligand structure facilitated the continuous release of reducing NH2 groups and formed a stable inert H_(2)O/CO_(2)atmosphere,effectively suppressing the oxidation of CuNPs during air sintering.Residual bidentate ethylenediamine ligands further enhanced the oxidation resistance of sintered structures at elevated temperatures.The optimized CuNPs could achieve ultralow resistivity:6.91μΩcm at 300℃and 4.99μΩcm at 350℃,and exhibit high-temperature oxidation resistance comparable to bulk Cu.When utilized in conjunction with flexible capacitive pressure sensors,the optimized CuNP sintered electrodes exhibited notable sensing stability,retaining robust signals for 100 cycles even at 350℃.The findings underscore the great potential of dual-ligand CuNPs for high-temperature antioxidant applications.

关 键 词：air sintering Cu nanoparticle flexible sensor high-temperature antioxidant 

分 类 号：TG1[金属学及工艺—金属学]