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作 者:陈田[1] 章云飞 刘军[1] 鲁迎春 吴大平 陈炜坤 邵宇寒 CHEN Tian;ZHANG Yunfei;LIU Jun;LU Yingchun;WU Daping;CHEN Weikun;SHAO Yuhan(School of Computer and Information,Hefei University of Technology,Hefei 230009,China;School of Microelectronics,Hefei University of Technology,Hefei 230009,China)
机构地区:[1]合肥工业大学计算机与信息学院,安徽合肥230009 [2]合肥工业大学微电子学院,安徽合肥230009
出 处:《微电子学与计算机》2025年第3期92-99,共8页Microelectronics & Computer
基 金:国家自然科学基金(62174048);国家重大科研仪器项目(62027815);省级大学生创新训练项目(S202310359083)。
摘 要:硅通孔(Through Silicon Via,TSV)是堆叠形成三维芯片(Three-Dimensional Chips,3D ICs)的关键部件,因此在制造过程中检测出TSV故障是十分重要的。目前的测试方法存在测试成本较高、难以使用同一结构对TSV键合的全过程进行测试以及无法分辨TSV故障的类型等问题。为此,提出了一种基于可重配置的环形振荡器结构的TSV检测方法。该方法能够在TSV制造的各个阶段同时测试多个TSV,并且根据键合前和键合后振荡周期的变化,判断TSV故障的类型,定位发生故障的TSV。HSPICE的仿真结果表明,所提结构可以有效检测并定位TSV各阶段的故障。Through Silicon Via(TSV)is the key component in stacking Three-Dimensional Chips(3D ICs),so it is imperative to detect TSV faults during manufacturing process.The current test methods have some problems,such as high test cost,difficult to use the same structure to test the whole process of TSV bonding,and can not distinguish the fault types of TSV.Therefore,a TSV detection method based on reconfigurable ring oscillator structure is proposed.This method can test multiple TSVs simultaneously at various stages of TSV manufacturing,and according to the change of oscillation period before and after bonding,the fault type of TSV can be determined and the faulty TSV can be located.The simulation results of HSPICE show that the proposed structure can effectively detect and locate faults in each stage of TSV.
分 类 号:TN407[电子电信—微电子学与固体电子学]
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