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机构地区:[1]沈阳航空航天大学国际工程师学院,沈阳110136 [2]沈阳航空航天大学航空发动机学院,沈阳110136
出 处:《科技创新与应用》2025年第8期77-81,共5页Technology Innovation and Application
摘 要:微通道热沉作为一种散热效率较高的散热器件,被广泛应用于芯片散热领域。对微通道热沉的结构进行改良,对传统微通道热沉、椭圆形肋微通道热沉、矩形侧肋微通道热沉以及两者结合组成的新型微通道热沉进行数值模拟,用流固耦合壁面面积、压降和达西摩擦因子评估热沉的流动性能,用热阻和努塞尔数评估热沉的传热性能,最后利用热沉综合性能评价因子对以上4种热沉进行流动传热综合性能评估。结果表明,在低流速下,椭圆形针肋微通道热沉具有最佳的综合性能,在高流速下,椭圆形针肋和矩形侧肋结合的新型微通道热沉具有最佳的综合性能。As a heat dissipation device with high heat dissipation efficiency,microchannel heat sinks are widely used in the field of chip heat dissipation.The structure of the microchannel heat sink was improved,and numerical simulations were carried out on traditional microchannel heat sinks,elliptical ribbed microchannel heat sinks,rectangular side-ribbed microchannel heat sinks and new microchannel heat sinks composed of the two.The flow performance of the heat sink was evaluated using fluid-solid coupling wall area,pressure drop and Darcy friction factor,and the heat transfer performance of the heat sink was evaluated using thermal resistance and Nusselt number.Finally,the comprehensive performance evaluation factor of the heat sink was used to evaluate the flow and heat transfer performance of the above four heat sinks.The results show that at low flow rates,the elliptical needle fin microchannel heat sink has the best comprehensive performance,and at high flow rates,the new microchannel heat sink combining elliptical needle fins and rectangular side ribs has the best comprehensive performance.
分 类 号:TK124[动力工程及工程热物理—工程热物理]
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