有机硅改性环氧树脂封装胶材料的应用  

Application of silicone-modified epoxy resin encapsulation adhesive material

作　　者：陈建 CHEN Jian(Tangshan Sanyou Silicon Industry Co.,Ltd.,Hebei Organosilicon New Material Technology Innovation Center,Tangshan 063305,China)

机构地区：[1]唐山三友硅业股份有限公司,河北省有机硅新材料技术创新中心,河北唐山063305

出　　处：《精细与专用化学品》2025年第3期30-32,共3页Fine and Specialty Chemicals

摘　　要：针对环氧树脂封装胶材料在高温、湿度环境下性能下降的问题,介绍了有机硅改性环氧树脂封装胶的制备过程及其性能和应用。Aiming at the problem of performance degradation of epoxy resin encapsulating adhesive material under high temperature and humidity environment,the preparation process of organosilicon modified epoxy resin encapsulating adhesive as well as the exploration of its performance and application were introduced.

关 键 词：有机硅改性环氧树脂 封装胶材料 耐温耐湿性能 材料制备 电子设备封装 

分 类 号：TQ322[化学工程—合成树脂塑料工业]